Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 065115/0454 | |
| Pages: | 15 |
| | Recorded: | 10/04/2023 | | |
| Attorney Dkt #: | P20-290-US-PCT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18255530
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Filing Dt:
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06/01/2023
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Publication #:
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Pub Dt:
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01/04/2024
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Title:
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Chemical Mechanical Planarization (CMP) For Copper And Through-Silicon Via (TSV)
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Assignee
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| 8555 SOUTH RIVER PARKWAY |
| PATENT DEPT. |
| TEMPE, ARIZONA 85284 |
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Correspondence name and address
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LISA HOFFMANN
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7350 TILGHMAN STREET, SUITE 104
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PATENT DEPT.
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ALLENTOWN, PA 18106-9000
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