Patent Assignment Details
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Reel/Frame: | 065299/0439 | |
| Pages: | 14 |
| | Recorded: | 10/20/2023 | | |
Attorney Dkt #: | 050083-0698 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18275177
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Filing Dt:
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07/31/2023
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Publication #:
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Pub Dt:
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02/29/2024
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Title:
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Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
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Assignees
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158-1 OAZA SAYAMAGAHARA, IRUMA-SHI |
SAITAMA, JAPAN 358-0032 |
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13-1, NIHONBASHI 1-CHOME, CHUO-KU |
TOKYO, JAPAN 103-0027 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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500 NORTH CAPITOL STREET, NW
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WASHINGTON, DC 20001
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Search Results as of:
04/29/2024 07:37 PM
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