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Reel/Frame:065338/0047   Pages: 3
Recorded: 10/25/2023
Attorney Dkt #:2900-162/24061.3921US04
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18360055
Filing Dt:
07/27/2023
Publication #:
Pub Dt:
11/16/2023
Title:
UNDER-CUT VIA ELECTRODE FOR SUB 60NM ETCHLESS MRAM DEVICES BY DECOUPLING THE VIA ETCH PROCESS
Assignors
1
Exec Dt:
05/30/2018
2
Exec Dt:
05/31/2018
3
Exec Dt:
05/31/2018
Assignee
1
678 SOUTH HILLVIEW DRIVE
MILPITAS, CALIFORNIA 95035
Correspondence name and address
HAYNES AND BOONE LLP (24061) IP SECTION
2801 N. HARWOOD ST.
SUITE 2300
DALLAS, TX 75201

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