Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 065368/0054 | |
| Pages: | 5 |
| | Recorded: | 10/27/2023 | | |
| Attorney Dkt #: | Q289468 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18495857
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Filing Dt:
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10/27/2023
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Publication #:
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Pub Dt:
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03/21/2024
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Title:
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BONDED BODY, SUBSTRATE, METHOD FOR PRODUCING BONDED BODY, AND METHOD FOR PRODUCING SUBSTRATE
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Assignees
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| 3-1, HONGO 7-CHOME, BUNKYO-KU |
| BUNKYO-KU, TOKYO, JAPAN 113-8654 |
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| UMEDA CENTER BUILDING |
| 4-12, NAKAZAKI-NISHI 2-CHOME, KITA-KU |
| OSAKA-SHI, OSAKA, JAPAN 530-8323 |
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Correspondence name and address
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SUGHRUE MION, PLLC
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2000 PENNSYLVANIA AVENUE, NW
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SUITE 9000
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WASHINGTON, DC 20006-1811
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04/28/2024 12:38 PM
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