Patent Assignment Details
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| Reel/Frame: | 065519/0483 | |
| Pages: | 4 |
| | Recorded: | 11/10/2023 | | |
| Attorney Dkt #: | TSMCP1137USB |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18506186
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Filing Dt:
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11/10/2023
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Publication #:
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Pub Dt:
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03/07/2024
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Title:
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MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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ESCHWEILER & POTASHNIK, LLC
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195 S. MAIN ST., SUITE 400
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AKRON, OH 44308
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05/12/2024 04:04 AM
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