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Reel/Frame:065849/0798   Pages: 12
Recorded: 12/12/2023
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 32
1
Patent #:
7059942
Issue Dt:
06/13/2006
Application #:
10717032
Filing Dt:
11/18/2003
Publication #:
US20040157536
Pub Dt:
08/12/2004
Title:
METHOD OF BACKGRINDING WAFERS WHILE LEAVING BACKGRINDING TAPE ON A CHUCK
2
Patent #:
7235154
Issue Dt:
06/26/2007
Application #:
10754360
Filing Dt:
01/08/2004
Publication #:
US20050150599
Pub Dt:
07/14/2005
Title:
DEVICES AND METHODS FOR OPTICAL ENDPOINT DETECTION DURING SEMICONDUCTOR WAFER POLISHING
3
Patent #:
7052366
Issue Dt:
05/30/2006
Application #:
10785393
Filing Dt:
02/23/2004
Publication #:
US20040229545
Pub Dt:
11/18/2004
Title:
ENDPOINT DETECTION SYSTEM FOR WAFER POLISHING
4
Patent #:
6986701
Issue Dt:
01/17/2006
Application #:
10850346
Filing Dt:
05/20/2004
Publication #:
US20050009449
Pub Dt:
01/13/2005
Title:
POLISHING PAD WITH BUILT-IN OPTICAL SENSOR
5
Patent #:
7160808
Issue Dt:
01/09/2007
Application #:
10860381
Filing Dt:
06/01/2004
Publication #:
US20050009349
Pub Dt:
01/13/2005
Title:
CHUCK FOR SUPPORTING WAFERS WITH A FLUID
6
Patent #:
7040955
Issue Dt:
05/09/2006
Application #:
11046502
Filing Dt:
01/28/2005
Title:
CHEMICAL-MECHANICAL PLANARIZATION TOOL FORCE CALIBRATION METHOD AND SYSTEM
7
Patent #:
7033252
Issue Dt:
04/25/2006
Application #:
11055550
Filing Dt:
02/10/2005
Publication #:
US20050215182
Pub Dt:
09/29/2005
Title:
WAFER CARRIER WITH PRESSURIZED MEMBRANE AND RETAINING RING ACTUATOR
8
Patent #:
7063604
Issue Dt:
06/20/2006
Application #:
11072636
Filing Dt:
03/04/2005
Publication #:
US20050202765
Pub Dt:
09/15/2005
Title:
INDEPENDENT EDGE CONTROL FOR CMP CARRIERS
9
Patent #:
7063605
Issue Dt:
06/20/2006
Application #:
11084475
Filing Dt:
03/18/2005
Publication #:
US20050164617
Pub Dt:
07/28/2005
Title:
RETAINING RING FOR WAFER CARRIERS
10
Patent #:
7249992
Issue Dt:
07/31/2007
Application #:
11173992
Filing Dt:
07/01/2005
Publication #:
US20060035563
Pub Dt:
02/16/2006
Title:
METHOD, APPARATUS AND SYSTEM FOR USE IN PROCESSING WAFERS
11
Patent #:
7083497
Issue Dt:
08/01/2006
Application #:
11334148
Filing Dt:
01/17/2006
Publication #:
US20060116051
Pub Dt:
06/01/2006
Title:
POLISHING PAD WITH BUILT-IN OPTICAL SENSOR
12
Patent #:
7467990
Issue Dt:
12/23/2008
Application #:
11369700
Filing Dt:
03/06/2006
Publication #:
US20060166611
Pub Dt:
07/27/2006
Title:
BACK PRESSURE CONTROL SYSTEM FOR CMP AND WAFER POLISHING
13
Patent #:
7131892
Issue Dt:
11/07/2006
Application #:
11410440
Filing Dt:
04/24/2006
Publication #:
US20060194519
Pub Dt:
08/31/2006
Title:
WAFER CARRIER WITH PRESSURIZED MEMBRANE AND RETAINING RING ACTUATOR
14
Patent #:
7195541
Issue Dt:
03/27/2007
Application #:
11443788
Filing Dt:
05/30/2006
Publication #:
US20060217038
Pub Dt:
09/28/2006
Title:
ENDPOINT DETECTION SYSTEM FOR WAFER POLISHING
15
Patent #:
7458878
Issue Dt:
12/02/2008
Application #:
11548213
Filing Dt:
10/10/2006
Publication #:
US20070128983
Pub Dt:
06/07/2007
Title:
GRINDING APPARATUS AND METHOD
16
Patent #:
7238083
Issue Dt:
07/03/2007
Application #:
11594267
Filing Dt:
11/07/2006
Publication #:
US20070054603
Pub Dt:
03/08/2007
Title:
WAFER CARRIER WITH PRESSURIZED MEMBRANE AND RETAINING RING ACTUATOR
17
Patent #:
7551979
Issue Dt:
06/23/2009
Application #:
11600978
Filing Dt:
11/17/2006
Publication #:
US20070150100
Pub Dt:
06/28/2007
Title:
ROBOT CALIBRATION SYSTEM AND METHOD
18
Patent #:
7549909
Issue Dt:
06/23/2009
Application #:
11768873
Filing Dt:
06/26/2007
Publication #:
US20080032602
Pub Dt:
02/07/2008
Title:
METHODS FOR OPTICAL ENDPOINT DETECTION DURING SEMICONDUCTOR WAFER POLISHING
19
Patent #:
8052504
Issue Dt:
11/08/2011
Application #:
11829798
Filing Dt:
07/27/2007
Publication #:
US20070269986
Pub Dt:
11/22/2007
Title:
METHOD, APPARATUS AND SYSTEM FOR USE IN PROCESSING WAFERS
20
Patent #:
7959496
Issue Dt:
06/14/2011
Application #:
11969175
Filing Dt:
01/03/2008
Publication #:
US20090176445
Pub Dt:
07/09/2009
Title:
FLEXIBLE MEMBRANE ASSEMBLY FOR A CMP SYSTEM AND METHOD OF USING
21
Patent #:
8182312
Issue Dt:
05/22/2012
Application #:
12205861
Filing Dt:
09/06/2008
Publication #:
US20100062685
Pub Dt:
03/11/2010
Title:
CMP SYSTEM WITH WIRELESS ENDPOINT DETECTION SYSTEM
22
Patent #:
8133093
Issue Dt:
03/13/2012
Application #:
12287550
Filing Dt:
10/10/2008
Publication #:
US20100093264
Pub Dt:
04/15/2010
Title:
GRINDING APPARATUS HAVING AN EXTENDABLE WHEEL MOUNT
23
Patent #:
7918712
Issue Dt:
04/05/2011
Application #:
12705091
Filing Dt:
02/12/2010
Publication #:
US20100144244
Pub Dt:
06/10/2010
Title:
ENDPOINT DETECTION SYSTEM FOR WAFER POLISHING
24
Patent #:
8740673
Issue Dt:
06/03/2014
Application #:
13252897
Filing Dt:
10/04/2011
Publication #:
US20120088366
Pub Dt:
04/12/2012
Title:
CMP RETAINING RING WITH SOFT RETAINING RING INSERT
25
Patent #:
8565919
Issue Dt:
10/22/2013
Application #:
13290900
Filing Dt:
11/07/2011
Publication #:
US20120046781
Pub Dt:
02/23/2012
Title:
METHOD, APPARATUS AND SYSTEM FOR USE IN PROCESSING WAFERS
26
Patent #:
8520222
Issue Dt:
08/27/2013
Application #:
13291800
Filing Dt:
11/08/2011
Publication #:
US20130114090
Pub Dt:
05/09/2013
Title:
SYSTEM AND METHOD FOR IN SITU MONITORING OF TOP WAFER THICKNESS IN A STACK OF WAFERS
27
Patent #:
8968052
Issue Dt:
03/03/2015
Application #:
13656514
Filing Dt:
10/19/2012
Publication #:
US20130102227
Pub Dt:
04/25/2013
Title:
SYSTEMS AND METHODS OF WAFER GRINDING
28
Patent #:
8915771
Issue Dt:
12/23/2014
Application #:
13694723
Filing Dt:
12/27/2012
Publication #:
US20140187128
Pub Dt:
07/03/2014
Title:
Method and apparatus for cleaning grinding work chuck using a vacuum
29
Patent #:
9393669
Issue Dt:
07/19/2016
Application #:
13740101
Filing Dt:
01/11/2013
Publication #:
US20130130593
Pub Dt:
05/23/2013
Title:
SYSTEMS AND METHODS OF PROCESSING SUBSTRATES
30
Patent #:
9457446
Issue Dt:
10/04/2016
Application #:
14042591
Filing Dt:
09/30/2013
Publication #:
US20140134923
Pub Dt:
05/15/2014
Title:
METHODS AND SYSTEMS FOR USE IN GRIND SHAPE CONTROL ADAPTATION
31
Patent #:
9610669
Issue Dt:
04/04/2017
Application #:
14042600
Filing Dt:
09/30/2013
Publication #:
US20140134927
Pub Dt:
05/15/2014
Title:
METHODS AND SYSTEMS FOR USE IN GRIND SPINDLE ALIGNMENT
32
Patent #:
9082713
Issue Dt:
07/14/2015
Application #:
14525115
Filing Dt:
10/27/2014
Publication #:
US20150118826
Pub Dt:
04/30/2015
Title:
METHOD OF GRINDING WAFER STACKS TO PROVIDE UNIFORM RESIDUAL SILICON THICKNESS
Assignor
1
REVASUM, INC.
Exec Dt:
11/27/2023
Assignee
1
SQN VENTURE INCOME FUND II, LP
320 BROAD STREET
SUITE 250
CHARLESTON, SOUTH CAROLINA 29401
Correspondence name and address
JAMES GAMBULOS
55 EAST MONROE STREET
CHICAGO, IL 60603

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