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Reel/Frame:066026/0641   Pages: 11
Recorded: 01/04/2024
Attorney Dkt #:123426-US-PA
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18186209
Filing Dt:
03/20/2023
Publication #:
US20240096781
Pub Dt:
03/21/2024
Title:
PACKAGE STRUCTURE
Assignors
1
LU, CHUN-TI
Exec Dt:
09/23/2022
2
TSAI, HAO-YI
Exec Dt:
09/18/2022
3
LIU, CHIA-HUNG
Exec Dt:
09/18/2022
4
HU, YU-HSIANG
Exec Dt:
09/18/2022
5
LIN, HSIU-JEN
Exec Dt:
09/18/2022
6
LIU, TZUAN-HORNG
Exec Dt:
09/18/2022
7
CHANG, CHIH-HAO
Exec Dt:
09/19/2022
8
LIN, BO-JIUN
Exec Dt:
06/17/2023
9
CHEN, SHIH-WEI
Exec Dt:
09/18/2022
10
CHO, HUNG-CHUN
Exec Dt:
09/18/2022
11
NI, PEI-RONG
Exec Dt:
06/20/2023
12
HUANG, HSIN-WEI
Exec Dt:
09/18/2022
13
TSAI, ZHENG-GANG
Exec Dt:
11/30/2022
14
LIU, TAI-YOU
Exec Dt:
09/25/2022
15
SHIH, PO-CHANG
Exec Dt:
09/18/2022
16
HUANG, YU-TING
Exec Dt:
10/07/2022
Assignee
1
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300-78
Correspondence name and address
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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