Patent Assignment Details
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| Reel/Frame: | 066053/0238 | |
| Pages: | 9 |
| | Recorded: | 01/08/2024 | | |
| Attorney Dkt #: | 21657US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18034379
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Filing Dt:
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05/05/2023
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Publication #:
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Pub Dt:
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11/30/2023
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Title:
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SOLDERING APPARATUS AND SOLDERING SYSTEM, AND PROCESSING APPARATUS
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Assignee
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| 15-3, KONAN 2-CHOME, MINATO-KU |
| TOKYO, JAPAN 1086290 |
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Correspondence name and address
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XSENSUS, LLP
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100 DAINGERFIELD ROAD
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SUITE 402
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ALEXANDRIA, VA 22314
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05/17/2024 09:18 AM
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