Patent Assignment Details
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Reel/Frame: | 066061/0427 | |
| Pages: | 12 |
| | Recorded: | 01/09/2024 | | |
Attorney Dkt #: | 27257US02 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/18/2017
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Application #:
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15240534
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Filing Dt:
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08/18/2016
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Publication #:
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Pub Dt:
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01/05/2017
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Title:
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Method of manufacturing a semiconductor package
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Assignee
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2045 E. INNOVATION CIRCLE |
TEMPE, ARIZONA 85284 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 W. MADISON ST
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34TH FLOOR
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CHICAGO, IL 60661
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05/14/2024 09:38 PM
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