Patent Assignment Details
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Reel/Frame: | 066230/0303 | |
| Pages: | 6 |
| | Recorded: | 01/24/2024 | | |
Attorney Dkt #: | 1012-3042 / 2020P03541 US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/07/2024
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Application #:
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17388248
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Filing Dt:
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07/29/2021
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Publication #:
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Pub Dt:
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02/03/2022
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Title:
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Semiconductor Device Package Comprising Side Walls Connected with Contact Pads of a Semiconductor Die
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Assignee
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AM CAMPEON 1-15 |
NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER/INFINEON TECHNO
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PO BOX 1959
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CARY, NC 27512-1959
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05/10/2024 07:31 AM
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