Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 066444/0854 | |
| Pages: | 5 |
| | Recorded: | 02/12/2024 | | |
| Attorney Dkt #: | T93129US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/26/2024
|
Application #:
|
17515234
|
Filing Dt:
|
10/29/2021
|
|
Publication #:
|
|
Pub Dt:
|
05/04/2023
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING AN INTERDIGITATED MOLD ARRANGEMENT
|
|
|
Assignee
|
|
|
|
|
| 12500 TI BOULEVARD |
| M/S 3999 |
| DALLAS, TEXAS 75243 |
|
|
Correspondence name and address
|
| |
RICHANDA DAVIS
|
| |
P. O. BOX 655474
|
| |
M/S 3999
|
| |
DALLAS, TX 75265
|
Search Results as of:
04/27/2024 01:05 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
