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Patent Assignment Assignor Details
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Assignor Name : HI-TECH MOLD & ENGINEERING, INC.
Total Assignments: 2
Assignment: 1
Reel/Frame:050890/0170   Pages: 8
Recorded: 11/01/2019
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor
1
Exec Dt:
11/01/2019
Assignee
1
39200 SIX MILE ROAD
MC 7578
LIVONIA, MICHIGAN 48152
Properties
 
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Pub #
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15488928
 
15972832
Correspondence name and address
SUSAN M. KORNFIELD - BODMAN PLC
201 SOUTH DIVISION
SUITE 400
ANN ARBOR, MI 48104
Assignment: 2
Reel/Frame:058209/0976   Pages: 7
Recorded: 11/24/2021
Attorney Dkt #:104085-0557
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor
1
Exec Dt:
07/12/2021
Assignee
1
120 S. LASALLE STREET
CHICAGO, ILLINOIS 60603
Property
 
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15488928
Correspondence name and address
ERIC T. FINGERHUT
1301 K STREET, N.W., SUITE 1100 WEST
WASHINGTON, DC 20005

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