Patent Assignment Assignor Details
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Assignor Name :
HI-TECH MOLD & ENGINEERING, INC.
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Total Assignments:
2
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Assignment:
1
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Reel/Frame: | 050890/0170 | |
| Pages: | 8 |
| | Recorded: | 11/01/2019 | | |
Conveyance: | SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). |
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Assignee
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39200 SIX MILE ROAD |
MC 7578 |
LIVONIA, MICHIGAN 48152 |
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15488928
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15972832
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Correspondence name and address
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SUSAN M. KORNFIELD - BODMAN PLC
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201 SOUTH DIVISION
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SUITE 400
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ANN ARBOR, MI 48104
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Assignment:
2
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Reel/Frame: | 058209/0976 | |
| Pages: | 7 |
| | Recorded: | 11/24/2021 | | |
Attorney Dkt #: | 104085-0557 |
Conveyance: | SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). |
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Assignee
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120 S. LASALLE STREET |
CHICAGO, ILLINOIS 60603 |
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15488928
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Correspondence name and address
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ERIC T. FINGERHUT
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1301 K STREET, N.W., SUITE 1100 WEST
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WASHINGTON, DC 20005
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05/26/2024 11:54 PM
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