|
|
Patent #:
|
|
Issue Dt:
|
09/13/2011
|
Application #:
|
12259329
|
Filing Dt:
|
10/28/2008
|
Publication #:
|
|
Pub Dt:
|
02/26/2009
| | | | |
Title:
|
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH ELECTRODE FOR EXTERNAL CONNECTION AND SEMICONDUCTOR DEVICE OBTAINED BY MEANS OF SAID METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
08/30/2011
|
Application #:
|
12262057
|
Filing Dt:
|
10/30/2008
|
Publication #:
|
|
Pub Dt:
|
06/04/2009
| | | | |
Title:
|
START-UP CIRCUIT FOR GENERATING BANDGAP REFERENCE VOLTAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/24/2010
|
Application #:
|
12264029
|
Filing Dt:
|
11/03/2008
|
Publication #:
|
|
Pub Dt:
|
05/07/2009
| | | | |
Title:
|
INTEGRATED CIRCUIT EMBEDDED WITH NON-VOLATILE ONE-TIME-PROGRAMMABLE AND MULTIPLE-TIME PROGRAMMABLE MEMORY
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/2010
|
Application #:
|
12264060
|
Filing Dt:
|
11/03/2008
|
Publication #:
|
|
Pub Dt:
|
05/07/2009
| | | | |
Title:
|
METHOD OF MAKING INTEGRATED CIRCUIT EMBEDDED WITH NON-VOLATILE ONE-TIME - PROGRAMMABLE AND MULTIPLE-TIME PROGRAMMABLE MEMORY
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/2010
|
Application #:
|
12264076
|
Filing Dt:
|
11/03/2008
|
Publication #:
|
|
Pub Dt:
|
05/07/2009
| | | | |
Title:
|
METHOD OF OPERATING INTEGRATED CIRCUIT EMBEDDED WITH NON-VOLATILE ONE-TIME - PROGRAMMABLE AND MULTIPLE-TIME PROGRAMMABLE MEMORY
|
|
|
Patent #:
|
|
Issue Dt:
|
09/21/2010
|
Application #:
|
12268991
|
Filing Dt:
|
11/11/2008
|
Publication #:
|
|
Pub Dt:
|
05/21/2009
| | | | |
Title:
|
SYSTEMS AND METHODS OF REMOTELY ENABLING SOUND ENHANCEMENT TECHNIQUES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/05/2013
|
Application #:
|
12270585
|
Filing Dt:
|
11/13/2008
|
Publication #:
|
|
Pub Dt:
|
03/12/2009
| | | | |
Title:
|
3D IC METHOD AND DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/31/2011
|
Application #:
|
12270803
|
Filing Dt:
|
11/13/2008
|
Publication #:
|
|
Pub Dt:
|
03/19/2009
| | | | |
Title:
|
FLASH MEMORY AND METHOD FOR MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/14/2010
|
Application #:
|
12271647
|
Filing Dt:
|
11/14/2008
|
Publication #:
|
|
Pub Dt:
|
05/14/2009
| | | | |
Title:
|
INTEGRATED CIRCUIT EMBEDDED WITH NON-VOLATILE PROGRAMMABLE MEMORY HAVING VARIABLE COUPLING
|
|
|
Patent #:
|
|
Issue Dt:
|
11/12/2013
|
Application #:
|
12271666
|
Filing Dt:
|
11/14/2008
|
Publication #:
|
|
Pub Dt:
|
05/14/2009
| | | | |
Title:
|
METHOD OF MAKING INTEGRATED CIRCUIT EMBEDDED WITH NON-VOLATILE PROGRAMMABLE MEMORY HAVING VARIABLE COUPLING
|
|
|
Patent #:
|
|
Issue Dt:
|
01/25/2011
|
Application #:
|
12271680
|
Filing Dt:
|
11/14/2008
|
Publication #:
|
|
Pub Dt:
|
05/14/2009
| | | | |
Title:
|
METHOD OF OPERATING INTEGRATED CIRCUIT EMBEDDED WITH NON-VOLATILE PROGRAMMABLE MEMORY HAVING VARIABLE COUPLING RELATED APPLICATION DATA
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/2010
|
Application #:
|
12271695
|
Filing Dt:
|
11/14/2008
|
Publication #:
|
|
Pub Dt:
|
05/14/2009
| | | | |
Title:
|
INTEGRATED CIRCUIT EMBEDDED WITH NON-VOLATILE MULTIPLE-TIME PROGRAMMABLE MEMORY HAVING VARIABLE COUPLING
|
|
|
Patent #:
|
|
Issue Dt:
|
10/16/2012
|
Application #:
|
12273785
|
Filing Dt:
|
11/19/2008
|
Title:
|
MEMS DEPLOYMENT FLEXURES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/02/2011
|
Application #:
|
12273830
|
Filing Dt:
|
11/19/2008
|
Title:
|
PLANAR FLEXURE SYSTEM WITH HIGH PITCH STIFFNESS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/03/2011
|
Application #:
|
12277512
|
Filing Dt:
|
11/25/2008
|
Publication #:
|
|
Pub Dt:
|
05/27/2010
| | | | |
Title:
|
THROUGH SUBSTRATE VIAS FOR BACK-SIDE INTERCONNECTIONS ON VERY THIN SEMICONDUCTOR WAFERS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/01/2013
|
Application #:
|
12277519
|
Filing Dt:
|
11/25/2008
|
Publication #:
|
|
Pub Dt:
|
05/27/2010
| | | | |
Title:
|
3-D CIRCUITS WITH INTEGRATED PASSIVE DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
12/28/2010
|
Application #:
|
12283710
|
Filing Dt:
|
09/15/2008
|
Publication #:
|
|
Pub Dt:
|
01/22/2009
| | | | |
Title:
|
WIRE BONDED WAFER LEVEL CAVITY PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/15/2013
|
Application #:
|
12286102
|
Filing Dt:
|
09/26/2008
|
Publication #:
|
|
Pub Dt:
|
06/11/2009
| | | | |
Title:
|
FLIP CHIP INTERCONNECTION WITH DOUBLE POST
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12287380
|
Filing Dt:
|
10/08/2008
|
Publication #:
|
|
Pub Dt:
|
05/07/2009
| | | | |
Title:
|
Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
|
|
|
Patent #:
|
|
Issue Dt:
|
11/29/2011
|
Application #:
|
12289067
|
Filing Dt:
|
10/20/2008
|
Publication #:
|
|
Pub Dt:
|
04/22/2010
| | | | |
Title:
|
SYSTEMS AND METHODS FOR FREQUENCY OFFSET CORRECTION IN A DIGITAL RADIO BROADCAST RECEIVER
|
|
|
Patent #:
|
|
Issue Dt:
|
10/19/2010
|
Application #:
|
12291853
|
Filing Dt:
|
11/14/2008
|
Publication #:
|
|
Pub Dt:
|
03/19/2009
| | | | |
Title:
|
FORMATION OF CIRCUITRY WITH MODIFICATION OF FEATURE HEIGHT
|
|
|
Patent #:
|
|
Issue Dt:
|
11/08/2011
|
Application #:
|
12315855
|
Filing Dt:
|
12/04/2008
|
Publication #:
|
|
Pub Dt:
|
06/25/2009
| | | | |
Title:
|
METHOD OF FORMING A WAFER LEVEL PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2012
|
Application #:
|
12317707
|
Filing Dt:
|
12/23/2008
|
Publication #:
|
|
Pub Dt:
|
07/30/2009
| | | | |
Title:
|
INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/18/2012
|
Application #:
|
12318593
|
Filing Dt:
|
12/31/2008
|
Publication #:
|
|
Pub Dt:
|
07/01/2010
| | | | |
Title:
|
SYSTEMS AND METHODS FOR FAST SEEK AND SCAN FUNCTIONS IN A DIGITAL RADIO BROADCAST RECEIVER
|
|
|
Patent #:
|
|
Issue Dt:
|
10/19/2010
|
Application #:
|
12320053
|
Filing Dt:
|
01/15/2009
|
Publication #:
|
|
Pub Dt:
|
05/28/2009
| | | | |
Title:
|
SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, AND METHODS OF PRODUCING THE SAME DEVICE AND WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
11/01/2011
|
Application #:
|
12321210
|
Filing Dt:
|
01/16/2009
|
Publication #:
|
|
Pub Dt:
|
05/28/2009
| | | | |
Title:
|
METHOD OF MAKING A CONNECTION COMPONENT WITH POSTS AND PADS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/04/2011
|
Application #:
|
12323288
|
Filing Dt:
|
11/25/2008
|
Publication #:
|
|
Pub Dt:
|
12/24/2009
| | | | |
Title:
|
SEMICONDUCTOR DIE SEPARATION METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
10/25/2011
|
Application #:
|
12330441
|
Filing Dt:
|
12/08/2008
|
Publication #:
|
|
Pub Dt:
|
04/09/2009
| | | | |
Title:
|
SYSTEM AND METHOD FOR ENHANCED STREAMING AUDIO
|
|
|
Patent #:
|
|
Issue Dt:
|
11/29/2011
|
Application #:
|
12331731
|
Filing Dt:
|
12/10/2008
|
Publication #:
|
|
Pub Dt:
|
06/10/2010
| | | | |
Title:
|
ADAPTIVE IMPEDANCE MATCHING (AIM) FOR ELECTRICALLY SMALL RADIO RECEIVER ANTENNAS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/17/2011
|
Application #:
|
12334498
|
Filing Dt:
|
12/14/2008
|
Publication #:
|
|
Pub Dt:
|
06/25/2009
| | | | |
Title:
|
START-UP CIRCUIT FOR REFERENCE VOLTAGE GENERATION CIRCUIT
|
|
|
Patent #:
|
|
Issue Dt:
|
06/28/2011
|
Application #:
|
12334508
|
Filing Dt:
|
12/14/2008
|
Publication #:
|
|
Pub Dt:
|
06/25/2009
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
01/04/2011
|
Application #:
|
12340273
|
Filing Dt:
|
12/19/2008
|
Publication #:
|
|
Pub Dt:
|
06/25/2009
| | | | |
Title:
|
SEMICONDUCTOR CHIP, METHOD OF FABRICATING THE SAME AND SEMICONDUCTOR CHIP STACK PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/20/2012
|
Application #:
|
12340364
|
Filing Dt:
|
12/19/2008
|
Publication #:
|
|
Pub Dt:
|
06/25/2009
| | | | |
Title:
|
SYSTEM FOR ADJUSTING PERCEIVED LOUDNESS OF AUDIO SIGNALS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/02/2012
|
Application #:
|
12346955
|
Filing Dt:
|
12/31/2008
|
Publication #:
|
|
Pub Dt:
|
07/01/2010
| | | | |
Title:
|
SYNCHRONIZATION OF SEPARATED PLATFORMS IN AN HD RADIO BROADCAST SINGLE FREQUENCY NETWORK
|
|
|
Patent #:
|
|
Issue Dt:
|
08/03/2010
|
Application #:
|
12348143
|
Filing Dt:
|
01/02/2009
|
Publication #:
|
|
Pub Dt:
|
06/25/2009
| | | | |
Title:
|
FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCING EFFECTS OF SEED LAYER UNDERETCHING
|
|
|
Patent #:
|
|
Issue Dt:
|
06/29/2010
|
Application #:
|
12353728
|
Filing Dt:
|
01/14/2009
|
Title:
|
ZOOM LENS ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2012
|
Application #:
|
12360466
|
Filing Dt:
|
01/27/2009
|
Publication #:
|
|
Pub Dt:
|
07/30/2009
| | | | |
Title:
|
MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/25/2013
|
Application #:
|
12363530
|
Filing Dt:
|
01/30/2009
|
Publication #:
|
|
Pub Dt:
|
07/30/2009
| | | | |
Title:
|
MULTI-CHANNEL AUDIO ENHANCEMENT SYSTEM FOR USE IN RECORDING PLAYBACK AND METHODS FOR PROVIDING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
01/17/2012
|
Application #:
|
12372130
|
Filing Dt:
|
02/17/2009
|
Publication #:
|
|
Pub Dt:
|
11/12/2009
| | | | |
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2012
|
Application #:
|
12385660
|
Filing Dt:
|
04/15/2009
|
Publication #:
|
|
Pub Dt:
|
10/21/2010
| | | | |
Title:
|
SYSTEMS AND METHODS FOR TRANSMITTING MEDIA CONTENT VIA DIGITAL RADIO BROADCAST TRANSMISSION FOR SYNCHRONIZED RENDERING BY A RECEIVER
|
|
|
Patent #:
|
|
Issue Dt:
|
12/28/2010
|
Application #:
|
12391064
|
Filing Dt:
|
02/23/2009
|
Publication #:
|
|
Pub Dt:
|
06/25/2009
| | | | |
Title:
|
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
05/15/2012
|
Application #:
|
12403175
|
Filing Dt:
|
03/12/2009
|
Publication #:
|
|
Pub Dt:
|
09/17/2009
| | | | |
Title:
|
SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/2010
|
Application #:
|
12425682
|
Filing Dt:
|
04/17/2009
|
Publication #:
|
|
Pub Dt:
|
11/12/2009
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION
|
|
|
Patent #:
|
|
Issue Dt:
|
06/07/2011
|
Application #:
|
12432185
|
Filing Dt:
|
04/29/2009
|
Publication #:
|
|
Pub Dt:
|
11/12/2009
| | | | |
Title:
|
FORMATION OF A THROUGH-ELECTRODE BY INKJET DEPOSITION OF RESIN PASTES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/22/2011
|
Application #:
|
12433529
|
Filing Dt:
|
04/30/2009
|
Publication #:
|
|
Pub Dt:
|
09/17/2009
| | | | |
Title:
|
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE WITH A FUSE CIRCUIT
|
|
|
Patent #:
|
|
Issue Dt:
|
10/08/2013
|
Application #:
|
12435080
|
Filing Dt:
|
05/04/2009
|
Publication #:
|
|
Pub Dt:
|
11/04/2010
| | | | |
Title:
|
DUAL LENS DIGITAL ZOOM
|
|
|
Patent #:
|
|
Issue Dt:
|
09/07/2010
|
Application #:
|
12444677
|
Filing Dt:
|
04/07/2009
|
Publication #:
|
|
Pub Dt:
|
04/29/2010
| | | | |
Title:
|
METHOD OF FORMING AN INTERCONNECT STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/25/2014
|
Application #:
|
12456349
|
Filing Dt:
|
06/15/2009
|
Publication #:
|
|
Pub Dt:
|
12/24/2009
| | | | |
Title:
|
WAFER LEVEL EDGE STACKING
|
|
|
Patent #:
|
|
Issue Dt:
|
11/23/2010
|
Application #:
|
12458682
|
Filing Dt:
|
07/20/2009
|
Publication #:
|
|
Pub Dt:
|
01/28/2010
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
06/11/2013
|
Application #:
|
12459864
|
Filing Dt:
|
07/08/2009
|
Publication #:
|
|
Pub Dt:
|
01/14/2010
| | | | |
Title:
|
MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING
|
|
|
Patent #:
|
|
Issue Dt:
|
08/23/2011
|
Application #:
|
12463234
|
Filing Dt:
|
05/08/2009
|
Publication #:
|
|
Pub Dt:
|
11/11/2010
| | | | |
Title:
|
INTEGRATED LENS BARREL
|
|
|
Patent #:
|
|
Issue Dt:
|
01/11/2011
|
Application #:
|
12468520
|
Filing Dt:
|
05/19/2009
|
Publication #:
|
|
Pub Dt:
|
09/10/2009
| | | | |
Title:
|
METHOD AND APPARATUS FOR PACKAGING CIRCUIT DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/04/2011
|
Application #:
|
12470702
|
Filing Dt:
|
05/22/2009
|
Publication #:
|
|
Pub Dt:
|
09/24/2009
| | | | |
Title:
|
MULTI-LAYERED METAL INTERCONNECTION
|
|
|
Patent #:
|
|
Issue Dt:
|
05/15/2012
|
Application #:
|
12483751
|
Filing Dt:
|
06/12/2009
|
Publication #:
|
|
Pub Dt:
|
12/17/2009
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
11/08/2011
|
Application #:
|
12493957
|
Filing Dt:
|
06/29/2009
|
Publication #:
|
|
Pub Dt:
|
10/22/2009
| | | | |
Title:
|
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/02/2013
|
Application #:
|
12506065
|
Filing Dt:
|
07/20/2009
|
Publication #:
|
|
Pub Dt:
|
11/12/2009
| | | | |
Title:
|
WIREBONDING METHOD AND APPARATUS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/17/2013
|
Application #:
|
12539380
|
Filing Dt:
|
08/11/2009
|
Publication #:
|
|
Pub Dt:
|
02/17/2011
| | | | |
Title:
|
SYSTEM FOR INCREASING PERCEIVED LOUDNESS OF SPEAKERS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2014
|
Application #:
|
12551807
|
Filing Dt:
|
09/01/2009
|
Publication #:
|
|
Pub Dt:
|
01/21/2010
| | | | |
Title:
|
STACKED MICROELECTRONIC ASSEMBLIES
|
|
|
Patent #:
|
|
Issue Dt:
|
02/15/2011
|
Application #:
|
12557205
|
Filing Dt:
|
09/10/2009
|
Publication #:
|
|
Pub Dt:
|
01/07/2010
| | | | |
Title:
|
STACKED INTEGRATED CIRCUIT ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
06/19/2012
|
Application #:
|
12559329
|
Filing Dt:
|
09/14/2009
|
Publication #:
|
|
Pub Dt:
|
03/17/2011
| | | | |
Title:
|
SYSTEM FOR PROCESSING AN AUDIO SIGNAL TO ENHANCE SPEECH INTELLIGIBILITY
|
|
|
Patent #:
|
|
Issue Dt:
|
10/15/2013
|
Application #:
|
12587714
|
Filing Dt:
|
10/13/2009
|
Publication #:
|
|
Pub Dt:
|
02/11/2010
| | | | |
Title:
|
METHODS OF MAKING COMPLIANT SEMICONDUCTOR CHIP PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/17/2013
|
Application #:
|
12599257
|
Filing Dt:
|
10/21/2010
|
Publication #:
|
|
Pub Dt:
|
02/10/2011
| | | | |
Title:
|
IMAGE RESTORATION WITH ENHANCED FILTERING
|
|
|
Patent #:
|
|
Issue Dt:
|
02/28/2012
|
Application #:
|
12614346
|
Filing Dt:
|
11/06/2009
|
Publication #:
|
|
Pub Dt:
|
06/10/2010
| | | | |
Title:
|
CAMERA WITH IMAGE ENHANCEMENT FUNCTIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/10/2011
|
Application #:
|
12614835
|
Filing Dt:
|
11/09/2009
|
Publication #:
|
|
Pub Dt:
|
05/13/2010
| | | | |
Title:
|
DIFFERENTIAL PRE-EMPHASIS DRIVER
|
|
|
Patent #:
|
|
Issue Dt:
|
11/06/2012
|
Application #:
|
12629754
|
Filing Dt:
|
12/02/2009
|
Publication #:
|
|
Pub Dt:
|
05/06/2010
| | | | |
Title:
|
COMMON DRAIN NON-VOLATILE MULTIPLE-TIME PROGRAMMABLE MEMORY
|
|
|
Patent #:
|
|
Issue Dt:
|
05/14/2013
|
Application #:
|
12634218
|
Filing Dt:
|
12/09/2009
|
Publication #:
|
|
Pub Dt:
|
06/24/2010
| | | | |
Title:
|
TEMPERATURE INDEPENDENT REFERENCE CURRENT GENERATOR USING POSITIVE AND NEGATIVE TEMPERATURE COEFFICIENT CURRENTS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/18/2011
|
Application #:
|
12635570
|
Filing Dt:
|
12/10/2009
|
Publication #:
|
|
Pub Dt:
|
06/24/2010
| | | | |
Title:
|
LOW-DROPOUT VOLTAGE REGULATOR WITH LEVEL LIMITER LIMITING LEVEL OF OUTPUT VOLTAGE WHEN LEVEL OF LOAD CURRENT CHANGES AND METHOD OF OPERATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
01/31/2012
|
Application #:
|
12640766
|
Filing Dt:
|
12/17/2009
|
Publication #:
|
|
Pub Dt:
|
06/24/2010
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
07/12/2011
|
Application #:
|
12640993
|
Filing Dt:
|
12/17/2009
|
Publication #:
|
|
Pub Dt:
|
07/01/2010
| | | | |
Title:
|
BOOST OPERATIONAL AMPLIFIER
|
|
|
Patent #:
|
|
Issue Dt:
|
04/07/2015
|
Application #:
|
12646722
|
Filing Dt:
|
12/23/2009
|
Title:
|
WAFER SCALE OPTICS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/19/2012
|
Application #:
|
12650238
|
Filing Dt:
|
12/30/2009
|
Publication #:
|
|
Pub Dt:
|
07/01/2010
| | | | |
Title:
|
NON-VOLATILE ONE-TIME - PROGRAMMABLE AND MULTIPLE-TIME PROGRAMMABLE MEMORY CONFIGURATION CIRCUIT
|
|
|
Patent #:
|
|
Issue Dt:
|
10/01/2013
|
Application #:
|
12663205
|
Filing Dt:
|
04/13/2010
|
Publication #:
|
|
Pub Dt:
|
11/11/2010
| | | | |
Title:
|
NON-LINEAR TRANSFORMATIONS FOR ENHANCEMENT OF IMAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/11/2013
|
Application #:
|
12670952
|
Filing Dt:
|
05/14/2010
|
Publication #:
|
|
Pub Dt:
|
01/13/2011
| | | | |
Title:
|
RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/08/2013
|
Application #:
|
12671993
|
Filing Dt:
|
07/16/2010
|
Publication #:
|
|
Pub Dt:
|
10/13/2011
| | | | |
Title:
|
STACK PACKAGES USING RECONSTITUTED WAFERS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/18/2011
|
Application #:
|
12685378
|
Filing Dt:
|
01/11/2010
|
Publication #:
|
|
Pub Dt:
|
05/06/2010
| | | | |
Title:
|
FORWARD ERROR CORRECTION CODING FOR AM 9KHZ AND 10KHZ IN-BAND ON-CHANNEL DIGITAL AUDIO BROADCASTING SYSTEMS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/14/2013
|
Application #:
|
12710534
|
Filing Dt:
|
02/23/2010
|
Publication #:
|
|
Pub Dt:
|
08/26/2010
| | | | |
Title:
|
EQUALIZER FOR AM IN-BAND ON-CHANNEL RADIO RECEIVERS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/12/2013
|
Application #:
|
12720365
|
Filing Dt:
|
03/09/2010
|
Publication #:
|
|
Pub Dt:
|
09/15/2011
| | | | |
Title:
|
SCALABLE LOSSLESS AUDIO CODEC AND AUTHORING TOOL
|
|
|
Patent #:
|
|
Issue Dt:
|
01/18/2011
|
Application #:
|
12720368
|
Filing Dt:
|
03/09/2010
|
Publication #:
|
|
Pub Dt:
|
07/01/2010
| | | | |
Title:
|
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/11/2012
|
Application #:
|
12721067
|
Filing Dt:
|
03/10/2010
|
Publication #:
|
|
Pub Dt:
|
09/16/2010
| | | | |
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2011
|
Application #:
|
12722784
|
Filing Dt:
|
03/12/2010
|
Publication #:
|
|
Pub Dt:
|
09/16/2010
| | | | |
Title:
|
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CONDUCTIVE REFERENCE ELEMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
08/28/2012
|
Application #:
|
12722799
|
Filing Dt:
|
03/12/2010
|
Publication #:
|
|
Pub Dt:
|
09/16/2010
| | | | |
Title:
|
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND REFERENCE WIREBOND
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2013
|
Application #:
|
12723039
|
Filing Dt:
|
03/12/2010
|
Publication #:
|
|
Pub Dt:
|
09/16/2010
| | | | |
Title:
|
STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BOND PADS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/24/2013
|
Application #:
|
12727973
|
Filing Dt:
|
03/19/2010
|
Publication #:
|
|
Pub Dt:
|
09/23/2010
| | | | |
Title:
|
DUAL SENSOR CAMERA
|
|
|
Patent #:
|
|
Issue Dt:
|
10/18/2011
|
Application #:
|
12748101
|
Filing Dt:
|
03/26/2010
|
Publication #:
|
|
Pub Dt:
|
09/29/2011
| | | | |
Title:
|
METHOD FOR FORMING A THROUGH SILICON VIA (TSV)
|
|
|
Patent #:
|
|
Issue Dt:
|
09/10/2013
|
Application #:
|
12759196
|
Filing Dt:
|
04/13/2010
|
Publication #:
|
|
Pub Dt:
|
08/05/2010
| | | | |
Title:
|
MICRO PIN GRID ARRAY WITH PIN MOTION ISOLATION
|
|
|
Patent #:
|
|
Issue Dt:
|
10/11/2011
|
Application #:
|
12760094
|
Filing Dt:
|
04/14/2010
|
Publication #:
|
|
Pub Dt:
|
08/05/2010
| | | | |
Title:
|
MICROELECTRONIC PACKAGE WITH THERMAL ACCESS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2011
|
Application #:
|
12762915
|
Filing Dt:
|
04/19/2010
|
Publication #:
|
|
Pub Dt:
|
12/02/2010
| | | | |
Title:
|
VIRTUAL AUDIO PROCESSING FOR LOUDSPEAKER OR HEADPHONE PLAYBACK
|
|
|
Patent #:
|
|
Issue Dt:
|
01/10/2012
|
Application #:
|
12769930
|
Filing Dt:
|
04/29/2010
|
Publication #:
|
|
Pub Dt:
|
09/16/2010
| | | | |
Title:
|
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
09/09/2014
|
Application #:
|
12781741
|
Filing Dt:
|
05/17/2010
|
Publication #:
|
|
Pub Dt:
|
09/09/2010
| | | | |
Title:
|
AUDIO SIGNAL PROCESSING
|
|
|
Patent #:
|
|
Issue Dt:
|
02/14/2012
|
Application #:
|
12784806
|
Filing Dt:
|
05/21/2010
|
Publication #:
|
|
Pub Dt:
|
09/16/2010
| | | | |
Title:
|
MICROELECTRONIC ASSEMBLIES HAVING COMPLIANCY AND METHODS THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
11/13/2012
|
Application #:
|
12784841
|
Filing Dt:
|
05/21/2010
|
Publication #:
|
|
Pub Dt:
|
09/09/2010
| | | | |
Title:
|
CHIPS HAVING REAR CONTACTS CONNECTED BY THROUGH VIAS TO FRONT CONTACTS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2011
|
Application #:
|
12789683
|
Filing Dt:
|
05/28/2010
|
Publication #:
|
|
Pub Dt:
|
10/14/2010
| | | | |
Title:
|
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
03/18/2014
|
Application #:
|
12790646
|
Filing Dt:
|
05/28/2010
|
Publication #:
|
|
Pub Dt:
|
12/09/2010
| | | | |
Title:
|
MECHANICAL ISOLATION FOR MEMS ELECTRICAL CONTACTS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/30/2011
|
Application #:
|
12793824
|
Filing Dt:
|
06/04/2010
|
Publication #:
|
|
Pub Dt:
|
06/23/2011
| | | | |
Title:
|
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2015
|
Application #:
|
12805433
|
Filing Dt:
|
07/30/2010
|
Publication #:
|
|
Pub Dt:
|
02/03/2011
| | | | |
Title:
|
Systems, methods, and computer readable media for digital radio broadcast receiver memory and power reduction
|
|
|
Patent #:
|
|
Issue Dt:
|
02/25/2014
|
Application #:
|
12805469
|
Filing Dt:
|
08/02/2010
|
Publication #:
|
|
Pub Dt:
|
02/17/2011
| | | | |
Title:
|
Digital radio broadcast receiver, broadcasting methods and methods for tagging content of interest
|
|
|
Patent #:
|
|
Issue Dt:
|
03/01/2011
|
Application #:
|
12820478
|
Filing Dt:
|
06/22/2010
|
Publication #:
|
|
Pub Dt:
|
10/14/2010
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE EMPLOYING THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
03/25/2014
|
Application #:
|
12821454
|
Filing Dt:
|
06/23/2010
|
Publication #:
|
|
Pub Dt:
|
12/30/2010
| | | | |
Title:
|
ELECTRICAL INTERCONNECT FOR DIE STACKED IN ZIG-ZAG CONFIGURATION
|
|
|
Patent #:
|
|
Issue Dt:
|
04/23/2013
|
Application #:
|
12826340
|
Filing Dt:
|
06/29/2010
|
Publication #:
|
|
Pub Dt:
|
10/21/2010
| | | | |
Title:
|
FREQUENCY-WARPED AUDIO EQUALIZER
|
|
|
Patent #:
|
|
Issue Dt:
|
08/14/2012
|
Application #:
|
12829709
|
Filing Dt:
|
07/02/2010
|
Publication #:
|
|
Pub Dt:
|
10/28/2010
| | | | |
Title:
|
MICROELECTRONIC PACKAGES FABRICATED AT THE WAFER LEVEL AND METHODS THEREFOR
|
|