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Reel/Frame:	052920/0001			Pages:	262
		Recorded:	06/11/2020
Attorney Dkt #:	107980/17
Conveyance:	RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).

Total properties: 2080
Page 19 of 21
Pages: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

Patent #:	9196581	Issue Dt:	11/24/2015	Application #:	14252197	Filing Dt:	04/14/2014
Publication #:	US20140217584	Pub Dt:	08/07/2014
Title:	FLOW UNDERFILL FOR MICROELECTRONIC PACKAGES

Patent #:	9178548	Issue Dt:	11/03/2015	Application #:	14257286	Filing Dt:	04/21/2014
Publication #:	US20150303956	Pub Dt:	10/22/2015
Title:	FIRST ADJACENT CANCELLER (FAC) WITH IMPROVED BLENDING USING A PARAMETRIC FILTER

Patent #:	9437582	Issue Dt:	09/06/2016	Application #:	14257795	Filing Dt:	04/21/2014
Publication #:	US20140332982	Pub Dt:	11/13/2014
Title:	Stacked Microelectronic Assemblies

Patent #:	10248496	Issue Dt:	04/02/2019	Application #:	14266907	Filing Dt:	05/01/2014
Publication #:	US20140331111	Pub Dt:	11/06/2014
Title:	ITERATIVE FORWARD ERROR CORRECTION DECODING FOR FM IN-BAND ON-CHANNEL RADIO BROADCASTING SYSTEMS

Patent #:	9165793	Issue Dt:	10/20/2015	Application #:	14268899	Filing Dt:	05/02/2014
Publication #:	US20150318344	Pub Dt:	11/05/2015
Title:	MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT PACKAGES

Patent #:	9461015	Issue Dt:	10/04/2016	Application #:	14270885	Filing Dt:	05/06/2014
Publication #:	US20140239513	Pub Dt:	08/28/2014
Title:	ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS

Patent #:	9521755	Issue Dt:	12/13/2016	Application #:	14271959	Filing Dt:	05/07/2014
Publication #:	US20140240934	Pub Dt:	08/28/2014
Title:	MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE

Patent #:	9241420	Issue Dt:	01/19/2016	Application #:	14275098	Filing Dt:	05/12/2014
Publication #:	US20140268537	Pub Dt:	09/18/2014
Title:	IN-PACKAGE FLY-BY SIGNALING

Patent #:	9437566	Issue Dt:	09/06/2016	Application #:	14275514	Filing Dt:	05/12/2014
Publication #:	US20150325543	Pub Dt:	11/12/2015
Title:	CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE

Patent #:	9793198	Issue Dt:	10/17/2017	Application #:	14275519	Filing Dt:	05/12/2014
Publication #:	US20150325507	Pub Dt:	11/12/2015
Title:	CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE

Patent #:	9236365	Issue Dt:	01/12/2016	Application #:	14275678	Filing Dt:	05/12/2014
Publication #:	US20140332980	Pub Dt:	11/13/2014
Title:	METHODS OF FORMING 3-D CIRCUITS WITH INTEGRATED PASSIVE DEVICES

Patent #:	9402312	Issue Dt:	07/26/2016	Application #:	14275741	Filing Dt:	05/12/2014
Publication #:	US20150327367	Pub Dt:	11/12/2015
Title:	CIRCUIT ASSEMBLIES WITH MULTIPLE INTERPOSER SUBSTRATES, AND METHODS OF FABRICATION

Patent #:	9257396	Issue Dt:	02/09/2016	Application #:	14284969	Filing Dt:	05/22/2014
Publication #:	US20150340327	Pub Dt:	11/26/2015
Title:	COMPACT SEMICONDUCTOR PACKAGE AND RELATED METHODS

Patent #:	9184804	Issue Dt:	11/10/2015	Application #:	14285318	Filing Dt:	05/22/2014
Publication #:	US20140254654	Pub Dt:	09/11/2014
Title:	METHOD AND APPARATUS FOR IMPLEMENTING SIGNAL QUALITY METRICS AND ANTENNA DIVERSITY SWITCHING CONTROL

Patent #:	9557364	Issue Dt:	01/31/2017	Application #:	14286159	Filing Dt:	05/23/2014
Publication #:	US20140253145	Pub Dt:	09/11/2014
Title:	SYSTEM AND METHOD FOR TESTING FUSE BLOW RELIABILITY FOR INTEGRATED CIRCUITS

Patent #:	9355997	Issue Dt:	05/31/2016	Application #:	14288064	Filing Dt:	05/27/2014
Publication #:	US20150262972	Pub Dt:	09/17/2015
Title:	INTEGRATED CIRCUIT ASSEMBLIES WITH REINFORCEMENT FRAMES, AND METHODS OF MANUFACTURE

Patent #:	10381326	Issue Dt:	08/13/2019	Application #:	14289483	Filing Dt:	05/28/2014
Publication #:	US20150348940	Pub Dt:	12/03/2015
Title:	STRUCTURE AND METHOD FOR INTEGRATED CIRCUITS PACKAGING WITH INCREASED DENSITY

Patent #:	9646917	Issue Dt:	05/09/2017	Application #:	14289860	Filing Dt:	05/29/2014
Publication #:	US20150348873	Pub Dt:	12/03/2015
Title:	LOW CTE COMPONENT WITH WIRE BOND INTERCONNECTS

Patent #:	9190463	Issue Dt:	11/17/2015	Application #:	14291672	Filing Dt:	05/30/2014
Publication #:	US20140273393	Pub Dt:	09/18/2014
Title:	HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS

Patent #:	9412714	Issue Dt:	08/09/2016	Application #:	14291874	Filing Dt:	05/30/2014
Publication #:	US20150348928	Pub Dt:	12/03/2015
Title:	WIRE BOND SUPPORT STRUCTURE AND MICROELECTRONIC PACKAGE INCLUDING WIRE BONDS THEREFROM

Patent #:	9037103	Issue Dt:	05/19/2015	Application #:	14296578	Filing Dt:	06/05/2014
Publication #:	US20140342682	Pub Dt:	11/20/2014
Title:	MRC ANTENNA DIVERSITY FOR FM IBOC DIGITAL SIGNALS

Patent #:	9082753	Issue Dt:	07/14/2015	Application #:	14297701	Filing Dt:	06/06/2014
Publication #:	US20150129647	Pub Dt:	05/14/2015
Title:	SEVERING BOND WIRE BY KINKING AND TWISTING

Patent #:	9412806	Issue Dt:	08/09/2016	Application #:	14304535	Filing Dt:	06/13/2014
Publication #:	US20150364538	Pub Dt:	12/17/2015
Title:	MAKING MULTILAYER 3D CAPACITORS USING ARRAYS OF UPSTANDING RODS OR RIDGES

Patent #:	8981579	Issue Dt:	03/17/2015	Application #:	14306947	Filing Dt:	06/17/2014
Publication #:	US20140291871	Pub Dt:	10/02/2014
Title:	IMPEDANCE CONTROLLED PACKAGES WITH METAL SHEET OR 2-LAYER RDL

Patent #:	NONE	Issue Dt:		Application #:	14309703	Filing Dt:	06/19/2014
Publication #:	US20150371938	Pub Dt:	12/24/2015
Title:	BACK-END-OF-LINE STACK FOR A STACKED DEVICE

Patent #:	9106472	Issue Dt:	08/11/2015	Application #:	14316852	Filing Dt:	06/27/2014
Title:	CHANNEL STATE INFORMATION (CSI) ESTIMATION AND APPLICATIONS FOR IN-BAND ON-CHANNEL RADIO RECEIVERS

Patent #:	9099482	Issue Dt:	08/04/2015	Application #:	14323329	Filing Dt:	07/03/2014
Publication #:	US20140315384	Pub Dt:	10/23/2014
Title:	METHOD OF PROCESSING A DEVICE SUBSTRATE

Patent #:	9621772	Issue Dt:	04/11/2017	Application #:	14327490	Filing Dt:	07/09/2014
Publication #:	US20150002726	Pub Dt:	01/01/2015
Title:	INTEGRATED LENS BARREL, ACTUATOR, AND MEMS SNUBBER SYSTEMS AND METHODS

Patent #:	9401288	Issue Dt:	07/26/2016	Application #:	14327982	Filing Dt:	07/10/2014
Publication #:	US20140322864	Pub Dt:	10/30/2014
Title:	LOW CTE INTERPOSER

Patent #:	9252127	Issue Dt:	02/02/2016	Application #:	14328380	Filing Dt:	07/10/2014
Publication #:	US20160013151	Pub Dt:	01/14/2016
Title:	MICROELECTRONIC ASSEMBLIES WITH INTEGRATED CIRCUITS AND INTERPOSERS WITH CAVITIES, AND METHODS OF MANUFACTURE

Patent #:	9385036	Issue Dt:	07/05/2016	Application #:	14329744	Filing Dt:	07/11/2014
Publication #:	US20140319699	Pub Dt:	10/30/2014
Title:	RELIABLE PACKAGING AND INTERCONNECT STRUCTURES

Patent #:	9426598	Issue Dt:	08/23/2016	Application #:	14332098	Filing Dt:	07/15/2014
Publication #:	US20150016642	Pub Dt:	01/15/2015
Title:	SPATIAL CALIBRATION OF SURROUND SOUND SYSTEMS INCLUDING LISTENER POSITION ESTIMATION

Patent #:	9433093	Issue Dt:	08/30/2016	Application #:	14337196	Filing Dt:	07/21/2014
Publication #:	US20150146393	Pub Dt:	05/28/2015
Title:	HIGH STRENGTH THROUGH-SUBSTRATE VIAS

Patent #:	9620436	Issue Dt:	04/11/2017	Application #:	14338327	Filing Dt:	07/22/2014
Publication #:	US20150295009	Pub Dt:	10/15/2015
Title:	LIGHT EMITTING DIODE DEVICE WITH RECONSTITUTED LED COMPONENTS ON SUBSTRATE

Patent #:	9355948	Issue Dt:	05/31/2016	Application #:	14340159	Filing Dt:	07/24/2014
Publication #:	US20150021788	Pub Dt:	01/22/2015
Title:	Multi-Function and Shielded 3D Interconnects

Patent #:	9349706	Issue Dt:	05/24/2016	Application #:	14380544	Filing Dt:	08/22/2014
Publication #:	US20150017765	Pub Dt:	01/15/2015
Title:	METHOD FOR PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

Patent #:	9338573	Issue Dt:	05/10/2016	Application #:	14447516	Filing Dt:	07/30/2014
Publication #:	US20150036849	Pub Dt:	02/05/2015
Title:	MATRIX DECODER WITH CONSTANT-POWER PAIRWISE PANNING

Patent #:	9281296	Issue Dt:	03/08/2016	Application #:	14448040	Filing Dt:	07/31/2014
Publication #:	US20160035703	Pub Dt:	02/04/2016
Title:	DIE STACKING TECHNIQUES IN BGA MEMORY PACKAGE FOR SMALL FOOTPRINT CPU AND MEMORY MOTHERBOARD DESIGN

Patent #:	9214425	Issue Dt:	12/15/2015	Application #:	14450109	Filing Dt:	08/01/2014
Publication #:	US20140332981	Pub Dt:	11/13/2014
Title:	LOW-STRESS VIAS

Patent #:	9224649	Issue Dt:	12/29/2015	Application #:	14451136	Filing Dt:	08/04/2014
Publication #:	US20140342503	Pub Dt:	11/20/2014
Title:	COMPLIANT INTERCONNECTS IN WAFERS

Patent #:	9349614	Issue Dt:	05/24/2016	Application #:	14453413	Filing Dt:	08/06/2014
Publication #:	US20160042978	Pub Dt:	02/11/2016
Title:	DEVICE AND METHOD FOR LOCALIZED UNDERFILL

Patent #:	9142511	Issue Dt:	09/22/2015	Application #:	14456726	Filing Dt:	08/11/2014
Publication #:	US20140346646	Pub Dt:	11/27/2014
Title:	STRUCTURES WITH THROUGH VIAS PASSING THROUGH A SUBSTRATE COMPRISING A PLANAR INSULATING LAYER BETWEEN SEMICONDUCTOR LAYERS

Patent #:	9166463	Issue Dt:	10/20/2015	Application #:	14456992	Filing Dt:	08/11/2014
Publication #:	US20150028698	Pub Dt:	01/29/2015
Title:	LINEARLY DEPLOYED ACTUATORS

Patent #:	8956916	Issue Dt:	02/17/2015	Application #:	14461919	Filing Dt:	08/18/2014
Publication #:	US20140357021	Pub Dt:	12/04/2014
Title:	MULTI-CHIP MODULE WITH STACKED FACE-DOWN CONNECTED DIES

Patent #:	9076700	Issue Dt:	07/07/2015	Application #:	14464026	Filing Dt:	08/20/2014
Publication #:	US20150001711	Pub Dt:	01/01/2015
Title:	SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Patent #:	NONE	Issue Dt:		Application #:	14466992	Filing Dt:	08/23/2014
Publication #:	US20150171027	Pub Dt:	06/18/2015
Title:	HIGH YIELD SUBSTRATE ASSEMBLY

Patent #:	NONE	Issue Dt:		Application #:	14466993	Filing Dt:	08/23/2014
Publication #:	US20150295151	Pub Dt:	10/15/2015
Title:	HIGH PERFORMANCE LIGHT EMITTING DIODE WITH VIAS

Patent #:	9287216	Issue Dt:	03/15/2016	Application #:	14472991	Filing Dt:	08/29/2014
Publication #:	US20140367866	Pub Dt:	12/18/2014
Title:	MEMORY MODULE IN A PACKAGE

Patent #:	9385024	Issue Dt:	07/05/2016	Application #:	14474476	Filing Dt:	09/02/2014
Publication #:	US20140370658	Pub Dt:	12/18/2014
Title:	ROOM TEMPERATURE METAL DIRECT BONDING

Patent #:	10434749	Issue Dt:	10/08/2019	Application #:	14474501	Filing Dt:	09/02/2014
Publication #:	US20150064498	Pub Dt:	03/05/2015
Title:	METHOD OF ROOM TEMPERATURE COVALENT BONDING

Patent #:	9178740	Issue Dt:	11/03/2015	Application #:	14478233	Filing Dt:	09/05/2014
Title:	PEAK-TO-AVERAGE POWER RATIO REDUCTION FOR QAM MODULATION WITH HD RADIO SIGNALS

Patent #:	9451052	Issue Dt:	09/20/2016	Application #:	14478905	Filing Dt:	09/05/2014
Publication #:	US20140379788	Pub Dt:	12/25/2014
Title:	INFORMATION DELIVERY SYSTEM FOR GENERATING A DATA STREAM WITH A SERVER SYSTEM BASED ON A CONTENT FILE RECEIVED FROM A CLIENT DEVICE

Patent #:	NONE	Issue Dt:		Application #:	14480373	Filing Dt:	09/08/2014
Publication #:	US20150056753	Pub Dt:	02/26/2015
Title:	Semiconductor Die Having Fine Pitch Electrical Interconnects

Patent #:	9551083	Issue Dt:	01/24/2017	Application #:	14482981	Filing Dt:	09/10/2014
Publication #:	US20160068988	Pub Dt:	03/10/2016
Title:	Paddle for Materials Processing

Patent #:	9263413	Issue Dt:	02/16/2016	Application #:	14486867	Filing Dt:	09/15/2014
Publication #:	US20150069639	Pub Dt:	03/12/2015
Title:	SUBSTRATE-LESS STACKABLE PACKAGE WITH WIRE-BOND INTERCONNECT

Patent #:	9496154	Issue Dt:	11/15/2016	Application #:	14488187	Filing Dt:	09/16/2014
Publication #:	US20160079093	Pub Dt:	03/17/2016
Title:	USE OF UNDERFILL TAPE IN MICROELECTRONIC COMPONENTS, AND MICROELECTRONIC COMPONENTS WITH CAVITIES COUPLED TO THROUGH-SUBSTRATE VIAS

Patent #:	9373585	Issue Dt:	06/21/2016	Application #:	14489358	Filing Dt:	09/17/2014
Publication #:	US20160079169	Pub Dt:	03/17/2016
Title:	POLYMER MEMBER BASED INTERCONNECT

Patent #:	NONE	Issue Dt:		Application #:	14492964	Filing Dt:	09/22/2014
Publication #:	US20150079733	Pub Dt:	03/19/2015
Title:	THREE-DIMENSIONAL SYSTEM-IN-A-PACKAGE

Patent #:	9691437	Issue Dt:	06/27/2017	Application #:	14496159	Filing Dt:	09/25/2014
Publication #:	US20160093340	Pub Dt:	03/31/2016
Title:	COMPACT MICROELECTRONIC ASSEMBLY HAVING REDUCED SPACING BETWEEN CONTROLLER AND MEMORY PACKAGES

Patent #:	9324681	Issue Dt:	04/26/2016	Application #:	14497572	Filing Dt:	09/26/2014
Publication #:	US20150011052	Pub Dt:	01/08/2015
Title:	PIN ATTACHMENT

Patent #:	9343398	Issue Dt:	05/17/2016	Application #:	14497825	Filing Dt:	09/26/2014
Publication #:	US20160093563	Pub Dt:	03/31/2016
Title:	BGA BALLOUT PARTITION TECHNIQUES FOR SIMPLIFIED LAYOUT IN MOTHERBOARD WITH MULTIPLE POWER SUPPLY RAIL

Patent #:	9362203	Issue Dt:	06/07/2016	Application #:	14499162	Filing Dt:	09/27/2014
Publication #:	US20150130077	Pub Dt:	05/14/2015
Title:	STAGED VIA FORMATION FROM BOTH SIDES OF CHIP

Patent #:	9601398	Issue Dt:	03/21/2017	Application #:	14500858	Filing Dt:	09/29/2014
Publication #:	US20150014688	Pub Dt:	01/15/2015
Title:	THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD

Patent #:	NONE	Issue Dt:		Application #:	14500874	Filing Dt:	09/29/2014
Publication #:	US20150017763	Pub Dt:	01/15/2015
Title:	Microelectronic Assembly With Thermally and Electrically Conductive Underfill

Patent #:	9496236	Issue Dt:	11/15/2016	Application #:	14501915	Filing Dt:	09/30/2014
Publication #:	US20150014850	Pub Dt:	01/15/2015
Title:	INTERCONNECT STRUCTURE

Patent #:	9560465	Issue Dt:	01/31/2017	Application #:	14506187	Filing Dt:	10/03/2014
Publication #:	US20160100268	Pub Dt:	04/07/2016
Title:	DIGITAL AUDIO FILTERS FOR VARIABLE SAMPLE RATES

Patent #:	9664922	Issue Dt:	05/30/2017	Application #:	14507722	Filing Dt:	10/06/2014
Publication #:	US20150085363	Pub Dt:	03/26/2015
Title:	MEMS-BASED OPTICAL IMAGE STABILIZATION

Patent #:	9318460	Issue Dt:	04/19/2016	Application #:	14513563	Filing Dt:	10/14/2014
Publication #:	US20150028480	Pub Dt:	01/29/2015
Title:	SUBSTRATE AND ASSEMBLY THEREOF WITH DIELECTRIC REMOVAL FOR INCREASED POST HEIGHT

Patent #:	9095074	Issue Dt:	07/28/2015	Application #:	14517268	Filing Dt:	10/17/2014
Publication #:	US20150034371	Pub Dt:	02/05/2015
Title:	STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAPSULATION SURFACE

Patent #:	NONE	Issue Dt:		Application #:	14523245	Filing Dt:	10/24/2014
Publication #:	US20150043181	Pub Dt:	02/12/2015
Title:	ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED GROUND OR POWER DISTRIBUTION

Patent #:	9558964	Issue Dt:	01/31/2017	Application #:	14524280	Filing Dt:	10/27/2014
Publication #:	US20150044820	Pub Dt:	02/12/2015
Title:	METHOD OF FABRICATING LOW CTE INTERPOSER WITHOUT TSV STRUCTURE

Patent #:	9337165	Issue Dt:	05/10/2016	Application #:	14525462	Filing Dt:	10/28/2014
Publication #:	US20150044824	Pub Dt:	02/12/2015
Title:	METHOD FOR MANUFACTURING A FAN-OUT WLP WITH PACKAGE

Patent #:	9627366	Issue Dt:	04/18/2017	Application #:	14529279	Filing Dt:	10/31/2014
Publication #:	US20150048524	Pub Dt:	02/19/2015
Title:	STACKED MICROELECTRONIC PACKAGES HAVING AT LEAST TWO STACKED MICROELECTRONIC ELEMENTS ADJACENT ONE ANOTHER

Patent #:	NONE	Issue Dt:		Application #:	14532396	Filing Dt:	11/04/2014
Publication #:	US20150054153	Pub Dt:	02/26/2015
Title:	FLIP CHIP INTERCONNECTION WITH DOUBLE POST

Patent #:	NONE	Issue Dt:		Application #:	14532806	Filing Dt:	11/04/2014
Publication #:	US20160049383	Pub Dt:	02/18/2016
Title:	AN INTEGRATED DEVICE PACKAGING HAVING THERMAL CONDUCTIVE POSTS FORMED ON INTEGRATED CIRCUIT DIE AND BETWEEN CONDUCTIVE INTERCONNECTS LAYERS

Patent #:	9583426	Issue Dt:	02/28/2017	Application #:	14533728	Filing Dt:	11/05/2014
Publication #:	US20160126174	Pub Dt:	05/05/2016
Title:	MULTI-LAYER SUBSTRATES SUITABLE FOR INTERCONNECTION BETWEEN CIRCUIT MODULES

Patent #:	9524883	Issue Dt:	12/20/2016	Application #:	14535159	Filing Dt:	11/06/2014
Publication #:	US20150333049	Pub Dt:	11/19/2015
Title:	HOLDING OF INTERPOSERS AND OTHER MICROELECTRONIC WORKPIECES IN POSITION DURING ASSEMBLY AND OTHER PROCESSING

Patent #:	9063278	Issue Dt:	06/23/2015	Application #:	14543847	Filing Dt:	11/17/2014
Publication #:	US20150070793	Pub Dt:	03/12/2015
Title:	MINIATURE MEMS ACTUATOR ASSEMBLIES

Patent #:	9423824	Issue Dt:	08/23/2016	Application #:	14545017	Filing Dt:	03/16/2015
Publication #:	US20150198971	Pub Dt:	07/16/2015
Title:	Stub minimization for multi-die wirebond assemblies with parallel windows

Patent #:	9425167	Issue Dt:	08/23/2016	Application #:	14545019	Filing Dt:	03/16/2015
Publication #:	US20150200183	Pub Dt:	07/16/2015
Title:	Stackable microelectronic package structures

Patent #:	9552819	Issue Dt:	01/24/2017	Application #:	14555324	Filing Dt:	11/26/2014
Publication #:	US20150170657	Pub Dt:	06/18/2015
Title:	MULTIPLET-BASED MATRIX MIXING FOR HIGH-CHANNEL COUNT MULTICHANNEL AUDIO

Patent #:	9524947	Issue Dt:	12/20/2016	Application #:	14557120	Filing Dt:	12/01/2014
Publication #:	US20150087146	Pub Dt:	03/26/2015
Title:	MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING

Patent #:	9484379	Issue Dt:	11/01/2016	Application #:	14557562	Filing Dt:	12/02/2014
Publication #:	US20150091120	Pub Dt:	04/02/2015
Title:	REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS

Patent #:	9324626	Issue Dt:	04/26/2016	Application #:	14558462	Filing Dt:	12/02/2014
Publication #:	US20150262928	Pub Dt:	09/17/2015
Title:	INTERPOSERS WITH CIRCUIT MODULES ENCAPSULATED BY MOLDABLE MATERIAL IN A CAVITY, AND METHODS OF FABRICATION

Patent #:	9123664	Issue Dt:	09/01/2015	Application #:	14559412	Filing Dt:	12/03/2014
Publication #:	US20150084188	Pub Dt:	03/26/2015
Title:	STACKABLE MOLDED MICROELECTRONIC PACKAGES

Patent #:	9318467	Issue Dt:	04/19/2016	Application #:	14563240	Filing Dt:	12/08/2014
Publication #:	US20150091194	Pub Dt:	04/02/2015
Title:	MULTI-DIE WIREBOND PACKAGES WITH ELONGATED WINDOWS

Patent #:	9224717	Issue Dt:	12/29/2015	Application #:	14564640	Filing Dt:	12/09/2014
Publication #:	US20150091118	Pub Dt:	04/02/2015
Title:	PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

Patent #:	9735084	Issue Dt:	08/15/2017	Application #:	14567918	Filing Dt:	12/11/2014
Publication #:	US20160172268	Pub Dt:	06/16/2016
Title:	Bond Via Array for Thermal Conductivity

Patent #:	NONE	Issue Dt:		Application #:	14570570	Filing Dt:	12/15/2014
Publication #:	US20150228633	Pub Dt:	08/13/2015
Title:	FRONT FACING PIGGYBACK WAFER ASSEMBLY

Patent #:	9118826	Issue Dt:	08/25/2015	Application #:	14570736	Filing Dt:	12/15/2014
Publication #:	US20150097981	Pub Dt:	04/09/2015
Title:	DUAL SENSOR CAMERA

Patent #:	10015881	Issue Dt:	07/03/2018	Application #:	14573461	Filing Dt:	12/17/2014
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Title:	Systems and Methods for Digital Radio Broadcast with Cross Platform Reception

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Title:	Systems and Methods for Digital Radio Broadcast with Cross Platform Reception

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