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Patent #:
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Issue Dt:
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11/12/2013
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Application #:
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13442015
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Filing Dt:
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04/09/2012
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Publication #:
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Pub Dt:
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10/10/2013
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Title:
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SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION
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Patent #:
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Issue Dt:
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02/04/2014
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Application #:
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13442878
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Filing Dt:
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04/10/2012
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Publication #:
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Pub Dt:
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10/18/2012
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Title:
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METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBSTRATE AND HEAT SINK
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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13447369
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Filing Dt:
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04/16/2012
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Publication #:
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Pub Dt:
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08/09/2012
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Title:
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METHOD OF FORMING AN INVERTED T SHAPED CHANNEL STRUCTURE FOR AN INVERTED T CHANNEL FIELD EFFECT TRANSISTOR DEVICE
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Patent #:
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Issue Dt:
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10/01/2013
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Application #:
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13455154
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Filing Dt:
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04/25/2012
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Title:
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PRESSURE SENSOR DEVICE AND METHOD OF ASSEMBLING SAME
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Patent #:
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Issue Dt:
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05/05/2015
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Application #:
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13457248
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Filing Dt:
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04/26/2012
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Publication #:
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Pub Dt:
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10/31/2013
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Title:
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MEMORY WITH WORD LEVEL POWER GATING
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Patent #:
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Issue Dt:
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11/01/2016
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Application #:
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13458224
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Filing Dt:
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04/27/2012
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Publication #:
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Pub Dt:
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10/31/2013
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Title:
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VERTICALLY PACKAGED INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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02/04/2014
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Application #:
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13461801
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Filing Dt:
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05/02/2012
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Publication #:
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Pub Dt:
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11/15/2012
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Title:
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SEMICONDUCTOR DEVICE WITH STAGGERED LEADS
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Patent #:
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Issue Dt:
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04/01/2014
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Application #:
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13462827
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Filing Dt:
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05/03/2012
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Publication #:
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Pub Dt:
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11/22/2012
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Title:
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FLANK WETTABLE SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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04/07/2015
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Application #:
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13463034
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Filing Dt:
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05/03/2012
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Publication #:
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Pub Dt:
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11/07/2013
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Title:
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VERIFICATION OF DESIGN DERIVED FROM POWER INTENT
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Patent #:
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Issue Dt:
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03/31/2015
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Application #:
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13477764
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Filing Dt:
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05/22/2012
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Publication #:
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Pub Dt:
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11/28/2013
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Title:
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LOW-TEMPERATURE FLIP CHIP DIE ATTACH
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Patent #:
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Issue Dt:
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12/09/2014
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Application #:
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13478557
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Filing Dt:
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05/23/2012
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Publication #:
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Pub Dt:
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11/28/2013
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Title:
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CAVITY-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SAME
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Patent #:
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Issue Dt:
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04/07/2015
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Application #:
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13483064
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Filing Dt:
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05/30/2012
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Publication #:
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Pub Dt:
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12/05/2013
| | | | |
Title:
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SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS
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Patent #:
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Issue Dt:
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04/08/2014
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Application #:
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13484022
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Filing Dt:
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05/30/2012
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Publication #:
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Pub Dt:
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12/05/2013
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Title:
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TECHNIQUES FOR CHECKING COMPUTER-AIDED DESIGN LAYERS OF A DEVICE TO REDUCE THE OCCURRENCE OF MISSING DECK RULES
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Patent #:
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Issue Dt:
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02/17/2015
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Application #:
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13484353
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Filing Dt:
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05/31/2012
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Publication #:
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Pub Dt:
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12/05/2013
| | | | |
Title:
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MOLD COMPOUND COMPATIBILITY TEST SYSTEM AND METHODS THEREOF
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Patent #:
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Issue Dt:
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03/18/2014
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Application #:
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13485912
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Filing Dt:
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05/31/2012
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Publication #:
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Pub Dt:
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12/05/2013
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Title:
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INTEGRATED CIRCUIT DIE ASSEMBLY WITH HEAT SPREADER
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Patent #:
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Issue Dt:
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03/18/2014
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Application #:
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13488452
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Filing Dt:
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06/05/2012
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Publication #:
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Pub Dt:
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12/05/2013
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Title:
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TEST EQUIPMENT MANIFOLD INTERFACE
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Patent #:
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Issue Dt:
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07/01/2014
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Application #:
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13489139
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Filing Dt:
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06/05/2012
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Publication #:
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Pub Dt:
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12/05/2013
| | | | |
Title:
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INDUCTIVE ELEMENT WITH INTERRUPTER REGION
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Patent #:
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Issue Dt:
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02/18/2014
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Application #:
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13489466
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Filing Dt:
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06/06/2012
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Publication #:
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Pub Dt:
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01/03/2013
| | | | |
Title:
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METHOD FOR MOLDING SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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04/08/2014
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Application #:
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13490451
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Filing Dt:
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06/06/2012
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Publication #:
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Pub Dt:
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01/24/2013
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Title:
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STACKED DIE SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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09/15/2015
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Application #:
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13500691
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Filing Dt:
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04/06/2012
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Publication #:
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Pub Dt:
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08/09/2012
| | | | |
Title:
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INTEGRATED CIRCUITS AND METHODS FOR DEBUGGING
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Patent #:
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Issue Dt:
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06/16/2015
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Application #:
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13523120
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Filing Dt:
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06/14/2012
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Publication #:
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Pub Dt:
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10/04/2012
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Title:
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REPLACEMENT-GATE-COMPATIBLE PROGRAMMABLE ELECTRICAL ANTIFUSE
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Patent #:
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Issue Dt:
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03/10/2015
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Application #:
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13529601
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Filing Dt:
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06/21/2012
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Publication #:
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Pub Dt:
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08/15/2013
| | | | |
Title:
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CELL ROUTABILITY PRIORITIZATION
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Patent #:
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Issue Dt:
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10/07/2014
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Application #:
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13530117
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Filing Dt:
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06/22/2012
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Publication #:
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Pub Dt:
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12/26/2013
| | | | |
Title:
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METHOD OF MAKING SURFACE MOUNT STACKED SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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08/19/2014
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Application #:
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13530118
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Filing Dt:
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06/22/2012
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Publication #:
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Pub Dt:
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12/26/2013
| | | | |
Title:
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SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS
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|
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Patent #:
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|
Issue Dt:
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06/30/2015
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Application #:
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13531317
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Filing Dt:
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06/22/2012
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Publication #:
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Pub Dt:
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12/26/2013
| | | | |
Title:
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Equivalence Classes Over Parameter State Space
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Patent #:
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Issue Dt:
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02/03/2015
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Application #:
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13534971
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Filing Dt:
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06/27/2012
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Publication #:
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Pub Dt:
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10/18/2012
| | | | |
Title:
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METHODS FOR FORMING HIGH GAIN TUNABLE BIPOLAR TRANSISTORS
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Patent #:
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Issue Dt:
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05/26/2015
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Application #:
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13535438
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Filing Dt:
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06/28/2012
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Publication #:
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Pub Dt:
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01/02/2014
| | | | |
Title:
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FILM-ASSIST MOLDED GEL-FILL CAVITY PACKAGE WITH OVERFLOW RESERVOIR
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Patent #:
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Issue Dt:
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02/25/2014
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Application #:
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13536694
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Filing Dt:
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06/28/2012
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Publication #:
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Pub Dt:
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01/02/2014
| | | | |
Title:
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METHOD FOR ANALYZING PLACEMENT CONTEXT SENSITIVITY OF STANDARD CELLS
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Patent #:
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Issue Dt:
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04/22/2014
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Application #:
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13537388
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Filing Dt:
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06/29/2012
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Publication #:
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Pub Dt:
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01/02/2014
| | | | |
Title:
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SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN AIR GAP AND METHOD FOR FORMING
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Patent #:
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Issue Dt:
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09/23/2014
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Application #:
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13537392
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Filing Dt:
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06/29/2012
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Publication #:
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Pub Dt:
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01/02/2014
| | | | |
Title:
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SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
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Patent #:
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Issue Dt:
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07/28/2015
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Application #:
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13538496
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Filing Dt:
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06/29/2012
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Publication #:
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Pub Dt:
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01/02/2014
| | | | |
Title:
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SYSTEMS AND METHODS FOR ANALYZING TRANSACTIONS IN A COMPUTER SYSTEM
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Patent #:
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Issue Dt:
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07/29/2014
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Application #:
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13538585
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Filing Dt:
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06/29/2012
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Publication #:
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Pub Dt:
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01/02/2014
| | | | |
Title:
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POWER TRANSISTOR WITH HEAT DISSIPATION AND METHOD THEREFOR
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Patent #:
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|
Issue Dt:
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08/27/2013
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Application #:
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13539394
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Filing Dt:
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06/30/2012
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Title:
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STATIC TIMING ANALYSIS ADJUSTMENTS FOR AGING EFFECTS
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Patent #:
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|
Issue Dt:
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01/06/2015
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Application #:
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13544430
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Filing Dt:
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07/09/2012
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Publication #:
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Pub Dt:
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01/09/2014
| | | | |
Title:
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DEVICE PACKAGE WITH RIGID INTERCONNECT STRUCTURE CONNECTING DIE AND SUBSTRATE AND METHOD THEREOF
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|
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Patent #:
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|
Issue Dt:
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05/26/2015
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Application #:
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13546902
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Filing Dt:
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07/11/2012
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Publication #:
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Pub Dt:
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01/16/2014
| | | | |
Title:
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SENSOR PACKAGE AND METHOD OF FORMING SAME
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|
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Patent #:
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|
Issue Dt:
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07/01/2014
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Application #:
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13548304
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Filing Dt:
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07/13/2012
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Publication #:
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Pub Dt:
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11/01/2012
| | | | |
Title:
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SHALLOW TRENCH ISOLATION FOR SOI STRUCTURES COMBINING SIDEWALL SPACER AND BOTTOM LINER
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Patent #:
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|
Issue Dt:
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08/18/2015
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Application #:
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13548848
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Filing Dt:
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07/13/2012
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Publication #:
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Pub Dt:
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01/16/2014
| | | | |
Title:
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SRAM BIT CELL WITH REDUCED BIT LINE PRE-CHARGE VOLTAGE
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Patent #:
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Issue Dt:
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03/03/2015
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Application #:
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13549040
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Filing Dt:
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07/13/2012
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Publication #:
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Pub Dt:
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01/16/2014
| | | | |
Title:
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CLASSIFYING PROCESSOR TESTCASES
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Patent #:
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Issue Dt:
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04/29/2014
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Application #:
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13549518
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Filing Dt:
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07/16/2012
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Publication #:
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Pub Dt:
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02/28/2013
| | | | |
Title:
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POWER DEVICE AND METHOD OF PACKAGING SAME
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Patent #:
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Issue Dt:
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02/04/2014
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Application #:
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13550627
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Filing Dt:
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07/17/2012
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Publication #:
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Pub Dt:
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01/23/2014
| | | | |
Title:
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PACKAGED SEMICONDUCTOR DIE WITH POWER RAIL PADS
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Patent #:
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Issue Dt:
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06/11/2013
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Application #:
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13550722
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Filing Dt:
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07/17/2012
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Publication #:
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Pub Dt:
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11/08/2012
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Title:
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METHODS FOR FORMING A MICRO ELECTRO-MECHANICAL DEVICE
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Patent #:
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Issue Dt:
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09/15/2015
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Application #:
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13556257
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Filing Dt:
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07/24/2012
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Publication #:
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Pub Dt:
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01/30/2014
| | | | |
Title:
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PREDICTION OF ELECTRONIC COMPONENT BEHAVIOR IN BUS-BASED SYSTEMS
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Patent #:
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Issue Dt:
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04/01/2014
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Application #:
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13560010
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Filing Dt:
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07/27/2012
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Publication #:
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Pub Dt:
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01/30/2014
| | | | |
Title:
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SINGLE-EVENT LATCH-UP PREVENTION TECHNIQUES FOR A SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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05/06/2014
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Application #:
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13562398
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Filing Dt:
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07/31/2012
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Publication #:
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Pub Dt:
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02/06/2014
| | | | |
Title:
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METHOD FOR PLATING A SEMICONDUCTOR PACKAGE LEAD
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Patent #:
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Issue Dt:
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04/22/2014
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Application #:
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13562443
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Filing Dt:
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07/31/2012
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Publication #:
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Pub Dt:
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02/06/2014
| | | | |
Title:
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METHOD AND SYSTEM FOR DERIVED LAYER CHECKING FOR SEMICONDUCTOR DEVICE DESIGN
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Patent #:
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Issue Dt:
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05/19/2015
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Application #:
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13562534
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Filing Dt:
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07/31/2012
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Publication #:
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Pub Dt:
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02/06/2014
| | | | |
Title:
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METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN METAL LAYERS
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Patent #:
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Issue Dt:
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01/28/2014
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Application #:
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13562538
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Filing Dt:
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07/31/2012
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Publication #:
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Pub Dt:
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02/06/2014
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Title:
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METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN METAL LAYERS
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Patent #:
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Issue Dt:
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09/29/2015
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Application #:
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13562853
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Filing Dt:
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07/31/2012
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Publication #:
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Pub Dt:
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02/06/2014
| | | | |
Title:
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CAPACITIVE PRESSURE SENSOR IN AN OVERMOLDED PACKAGE
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Patent #:
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Issue Dt:
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08/04/2015
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Application #:
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13569148
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Filing Dt:
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08/07/2012
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Publication #:
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Pub Dt:
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02/13/2014
| | | | |
Title:
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BLOCK-BASED CREST FACTOR REDUCTION
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Patent #:
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Issue Dt:
|
11/19/2013
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Application #:
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13577937
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Filing Dt:
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08/09/2012
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Publication #:
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Pub Dt:
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12/13/2012
| | | | |
Title:
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INTEGRATED CIRCUIT DESIGN TOOL APPARATUS AND METHOD OF DESIGNING AN INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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11/17/2015
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Application #:
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13591924
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Filing Dt:
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08/22/2012
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Publication #:
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Pub Dt:
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02/27/2014
| | | | |
Title:
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STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF
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Patent #:
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Issue Dt:
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07/28/2015
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Application #:
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13591969
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Filing Dt:
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08/22/2012
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Publication #:
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Pub Dt:
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02/27/2014
| | | | |
Title:
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STACKED MICROELECTRONIC PACKAGES HAVING PATTERNED SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF
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Patent #:
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Issue Dt:
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06/23/2015
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Application #:
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13591990
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Filing Dt:
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08/22/2012
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Publication #:
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Pub Dt:
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02/27/2014
| | | | |
Title:
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STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF
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Patent #:
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Issue Dt:
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04/29/2014
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Application #:
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13592764
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Filing Dt:
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08/23/2012
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Publication #:
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Pub Dt:
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02/27/2014
| | | | |
Title:
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SENSOR PACKAGES AND METHOD OF PACKAGING DIES OF DIFFERING SIZES
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Patent #:
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Issue Dt:
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09/10/2013
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Application #:
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13593608
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Filing Dt:
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08/24/2012
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Publication #:
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Pub Dt:
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12/27/2012
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Title:
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DEVICES WITH ZENER TRIGGERED ESD PROTECTION
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Patent #:
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Issue Dt:
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12/09/2014
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Application #:
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13594732
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Filing Dt:
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08/24/2012
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Publication #:
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Pub Dt:
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02/27/2014
| | | | |
Title:
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COPPER BALL BOND FEATURES AND STRUCTURE
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Patent #:
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Issue Dt:
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02/25/2014
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Application #:
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13597824
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Filing Dt:
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08/29/2012
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Publication #:
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Pub Dt:
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03/06/2014
| | | | |
Title:
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SENSOR PACKAGING METHOD AND SENSOR PACKAGES
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Patent #:
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Issue Dt:
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06/03/2014
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Application #:
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13599388
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Filing Dt:
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08/30/2012
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Publication #:
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Pub Dt:
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03/06/2014
| | | | |
Title:
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IDENTIFICATION MECHANISM FOR SEMICONDUCTOR DEVICE DIE
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Patent #:
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Issue Dt:
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09/16/2014
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Application #:
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13600364
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Filing Dt:
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08/31/2012
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Publication #:
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Pub Dt:
|
03/06/2014
| | | | |
Title:
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HEAT SPREADER FOR USE WITHIN A PACKAGED SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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11/11/2014
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Application #:
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13600648
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Filing Dt:
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08/31/2012
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Publication #:
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Pub Dt:
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03/06/2014
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Title:
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LEADFRAMES, AIR-CAVITY PACKAGES, AND ELECTRONIC DEVICES WITH OFFSET VENT HOLES, AND METHODS OF THEIR MANUFACTURE
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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13603402
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Filing Dt:
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09/04/2012
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Title:
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AUTOMATIC VERIFICATION OF DEPENDENCY
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Patent #:
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Issue Dt:
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07/30/2013
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Application #:
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13604641
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Filing Dt:
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09/06/2012
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Publication #:
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Pub Dt:
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05/16/2013
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Title:
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METHOD AND APPARATUS FOR MONITORING FREE AIR BALL (FAB) FORMATION IN WIRE BONDING
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Patent #:
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Issue Dt:
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02/04/2014
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Application #:
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13605990
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Filing Dt:
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09/06/2012
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Publication #:
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Pub Dt:
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09/12/2013
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Title:
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LEAD FRAME FOR ASSEMBLING SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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12/17/2013
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Application #:
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13606858
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Filing Dt:
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09/07/2012
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Title:
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Reducing Leakage in Standard Cells
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Patent #:
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Issue Dt:
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11/12/2013
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Application #:
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13606980
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Filing Dt:
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09/07/2012
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Title:
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ASSERTION-BASED DESIGN PARTITIONING
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Patent #:
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Issue Dt:
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04/30/2013
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Application #:
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13612466
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Filing Dt:
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09/12/2012
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Publication #:
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Pub Dt:
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01/10/2013
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Title:
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MULTI-VOLTAGE ELECTROSTATIC DISCHARGE PROTECTION
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Patent #:
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Issue Dt:
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12/30/2014
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Application #:
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13617851
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Filing Dt:
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09/14/2012
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Publication #:
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Pub Dt:
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03/20/2014
| | | | |
Title:
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Thermally Enhanced Package with Lid Heat Spreader
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Patent #:
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Issue Dt:
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10/13/2015
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Application #:
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13618185
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Filing Dt:
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09/14/2012
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Publication #:
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Pub Dt:
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03/20/2014
| | | | |
Title:
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MATRIX LID HEATSPREADER FOR FLIP CHIP PACKAGE
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Patent #:
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Issue Dt:
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04/22/2014
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Application #:
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13630996
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Filing Dt:
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09/28/2012
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Publication #:
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Pub Dt:
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04/03/2014
| | | | |
Title:
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METHOD AND APPARATUS TO IMPROVE RELIABILITY OF VIAS
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Patent #:
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Issue Dt:
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05/26/2015
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Application #:
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13632616
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Filing Dt:
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10/01/2012
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Publication #:
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Pub Dt:
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04/03/2014
| | | | |
Title:
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Multiply and Accumulate Feedback
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Patent #:
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Issue Dt:
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02/03/2015
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Application #:
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13657250
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Filing Dt:
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10/22/2012
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Publication #:
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Pub Dt:
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04/24/2014
| | | | |
Title:
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PACKAGING FOR SEMICONDUCTOR SENSOR DEVICES AND METHODS
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Patent #:
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Issue Dt:
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07/01/2014
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Application #:
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13660243
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Filing Dt:
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10/25/2012
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Publication #:
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Pub Dt:
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05/01/2014
| | | | |
Title:
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PACKAGED INTEGRATED CIRCUIT HAVING LARGE SOLDER PADS AND METHOD FOR FORMING
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Patent #:
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Issue Dt:
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12/16/2014
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Application #:
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13661861
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Filing Dt:
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10/26/2012
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Publication #:
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Pub Dt:
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05/01/2014
| | | | |
Title:
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SRAM WITH IMPROVED WRITE OPERATION
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Patent #:
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Issue Dt:
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08/02/2016
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Application #:
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13665864
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Filing Dt:
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10/31/2012
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Publication #:
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Pub Dt:
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05/01/2014
| | | | |
Title:
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METHOD AND APPARATUS FOR A TUNABLE DRIVER CIRCUIT
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Patent #:
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Issue Dt:
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07/21/2015
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Application #:
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13666289
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Filing Dt:
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11/01/2012
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Publication #:
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Pub Dt:
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05/01/2014
| | | | |
Title:
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Vector NCO and Twiddle Factor Generator
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Patent #:
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Issue Dt:
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06/30/2015
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Application #:
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13673212
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Filing Dt:
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11/09/2012
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Publication #:
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Pub Dt:
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05/15/2014
| | | | |
Title:
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WETTABLE LEAD ENDS ON A FLAT-PACK NO-LEAD MICROELECTRONIC PACKAGE
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Patent #:
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Issue Dt:
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10/28/2014
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Application #:
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13675008
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Filing Dt:
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11/13/2012
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Publication #:
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Pub Dt:
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05/15/2014
| | | | |
Title:
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TRACE ROUTING WITHIN A SEMICONDUCTOR PACKAGE SUBSTRATE
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Patent #:
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Issue Dt:
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01/05/2016
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Application #:
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13677800
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Filing Dt:
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11/15/2012
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Publication #:
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Pub Dt:
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05/15/2014
| | | | |
Title:
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INTEGRATED CIRCUIT WITH DEGRADATION MONITORING
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Patent #:
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Issue Dt:
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09/15/2015
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Application #:
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13678789
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Filing Dt:
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11/16/2012
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Publication #:
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Pub Dt:
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05/22/2014
| | | | |
Title:
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TABLE MODEL CIRCUIT SIMULATION ACCELERATION USING MODEL CACHING
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Patent #:
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Issue Dt:
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09/16/2014
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Application #:
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13681437
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Filing Dt:
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11/20/2012
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Publication #:
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Pub Dt:
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01/30/2014
| | | | |
Title:
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SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT
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Patent #:
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Issue Dt:
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07/26/2016
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Application #:
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13688820
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Filing Dt:
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11/29/2012
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Publication #:
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Pub Dt:
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05/29/2014
| | | | |
Title:
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ELECTRONIC DEVICES WITH EMBEDDED DIE INTERCONNECT STRUCTURES, AND METHODS OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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13689034
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Filing Dt:
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11/29/2012
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Publication #:
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Pub Dt:
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05/29/2014
| | | | |
Title:
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SEMICONDUCTOR DEVICE PACKAGE
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Patent #:
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Issue Dt:
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04/19/2016
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Application #:
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13689331
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Filing Dt:
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11/29/2012
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Publication #:
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Pub Dt:
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10/31/2013
| | | | |
Title:
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MEMORY COLUMN DROWSY CONTROL
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Patent #:
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Issue Dt:
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09/17/2013
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Application #:
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13689424
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Filing Dt:
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11/29/2012
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Title:
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PROVIDING AN AUTOMATIC OPTICAL INSPECTION FEATURE FOR SOLDER JOINTS ON SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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01/06/2015
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Application #:
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13718081
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Filing Dt:
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12/18/2012
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Publication #:
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Pub Dt:
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06/19/2014
| | | | |
Title:
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SEMICONDUCTOR PACKAGE SIGNAL ROUTING USING CONDUCTIVE VIAS
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Patent #:
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Issue Dt:
|
02/04/2014
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Application #:
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13735054
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Filing Dt:
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01/07/2013
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Title:
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INTEGRATED CIRCUIT DESIGN VERIFICATION SYSTEM
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Patent #:
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Issue Dt:
|
06/17/2014
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Application #:
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13746874
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Filing Dt:
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01/22/2013
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Title:
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DEVICES AND METHODS FOR CONFIGURING CONDUCTIVE ELEMENTS FOR A SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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08/04/2015
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Application #:
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13746891
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Filing Dt:
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01/22/2013
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Publication #:
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Pub Dt:
|
07/24/2014
| | | | |
Title:
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Vector Comparator System for Finding a Peak Number
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Patent #:
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Issue Dt:
|
10/27/2015
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Application #:
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13751318
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Filing Dt:
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01/28/2013
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Publication #:
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Pub Dt:
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05/30/2013
| | | | |
Title:
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ELECTRONIC DEVICE MODULE WITH INTEGRATED ANTENNA STRUCTURE, AND RELATED MANUFACTURING METHOD
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Patent #:
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Issue Dt:
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10/11/2016
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Application #:
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13754086
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Filing Dt:
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01/30/2013
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Publication #:
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Pub Dt:
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07/31/2014
| | | | |
Title:
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SEMICONDUCITIVE CATECHOL GROUP ENCAPSULANT ADHESION PROMOTER FOR A PACKAGED ELECTRONIC DEVICE
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Patent #:
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Issue Dt:
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08/18/2015
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Application #:
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13755904
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Filing Dt:
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01/31/2013
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Publication #:
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Pub Dt:
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07/31/2014
| | | | |
Title:
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METHOD FOR FORMNG A SEMICONDUCTOR DEVICE ASSEMBLY HAVING A HEAT SPREADER
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Patent #:
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Issue Dt:
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04/29/2014
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Application #:
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13758263
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Filing Dt:
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02/04/2013
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Title:
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LEAD FRAME ARRAY PACKAGE WITH FLIP CHIP DIE ATTACH
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Patent #:
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Issue Dt:
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03/03/2015
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Application #:
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13764958
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Filing Dt:
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02/12/2013
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Publication #:
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Pub Dt:
|
08/14/2014
| | | | |
Title:
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METHODS AND STRUCTURES FOR REDUCING STRESS ON DIE ASSEMBLY
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Patent #:
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Issue Dt:
|
06/03/2014
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Application #:
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13766445
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Filing Dt:
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02/13/2013
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Title:
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METHODS RELATING TO INTERMETALLIC TESTING OF BOND INTEGRITY BETWEEN BOND PADS AND COPPER-CONTAINING BOND WIRES
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Patent #:
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Issue Dt:
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08/19/2014
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Application #:
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13766771
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Filing Dt:
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02/13/2013
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Publication #:
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Pub Dt:
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08/14/2014
| | | | |
Title:
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SOLAR POWERED IC CHIP
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Patent #:
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Issue Dt:
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02/18/2014
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Application #:
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13767064
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Filing Dt:
|
02/14/2013
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Title:
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Timing Margins for On-chip Variations from Sensitivity Data
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Patent #:
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Issue Dt:
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10/07/2014
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Application #:
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13773594
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Filing Dt:
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02/21/2013
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Publication #:
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Pub Dt:
|
08/21/2014
| | | | |
Title:
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SEMICONDUCTOR PACKAGE WITH INNER AND OUTER LEADS
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Patent #:
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Issue Dt:
|
12/08/2015
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Application #:
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13773603
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Filing Dt:
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02/21/2013
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Publication #:
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Pub Dt:
|
08/21/2014
| | | | |
Title:
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SEMICONDUCTOR GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
|
02/03/2015
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Application #:
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13774486
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Filing Dt:
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02/22/2013
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Publication #:
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Pub Dt:
|
08/28/2014
| | | | |
Title:
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Thin Beam Deposited Fuse
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Patent #:
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Issue Dt:
|
05/26/2015
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Application #:
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13781722
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Filing Dt:
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02/28/2013
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Publication #:
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Pub Dt:
|
07/11/2013
| | | | |
Title:
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RESURF SEMICONDUCTOR DEVICE CHARGE BALANCING
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