Patent Assignment Details
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Reel/Frame: | 010975/0001 | |
| Pages: | 4 |
| | Recorded: | 07/28/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/28/2004
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Application #:
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09627979
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Filing Dt:
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07/28/2000
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Title:
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METHOD OF PACKAGING MULTI CHIP MODULE
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Assignee
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TANTZU |
NO. 123, SEC. 3, DA FONG RD. |
TAICHUNG, TAIWAN |
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Correspondence name and address
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JASON Z. LIN
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19597 VIA MONTE DRIVE
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SARATOGA, CA 95070
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