Patent Assignment Details
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Reel/Frame: | 022481/0001 | |
| Pages: | 3 |
| | Recorded: | 03/31/2009 | | |
Attorney Dkt #: | JCLA30154 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/10/2012
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Application #:
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12414996
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Filing Dt:
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03/31/2009
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Publication #:
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Pub Dt:
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05/06/2010
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Title:
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CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignee
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26, CHIN 3RD. RD., 811, NANTZE EXPORT |
PROCESSING ZONE, KAOHSIUNG, TAIWAN R.O.C. |
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Correspondence name and address
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J.C. PATENTS
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4, VENTURE SUITE 250
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IRVINE, CALIFORNIA 92618
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