Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 043753/0001 | |
| Pages: | 3 |
| | Recorded: | 10/02/2017 | | |
Attorney Dkt #: | 035706-0371-00-US-561580 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15486899
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Filing Dt:
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04/13/2017
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Publication #:
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Pub Dt:
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10/19/2017
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Title:
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Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device
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Assignee
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1-2 OTEMACHI 1-CHOME |
CHIYODA-KU |
TOKYO, JAPAN 1008164 |
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Correspondence name and address
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DRINKER BIDDLE & REATH ATTN: INTELLECTUA
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ONE LOGAN SQUARE, SUITE 2000
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PHILADELPHIA, PA 19103-6996
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