Patent Assignment Details
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| Reel/Frame: | 053843/0001 | |
| Pages: | 12 |
| | Recorded: | 09/22/2020 | | |
| Attorney Dkt #: | 3570-652 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/23/2024
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Application #:
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17040180
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Filing Dt:
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09/22/2020
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Publication #:
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Pub Dt:
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01/14/2021
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Title:
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RESIN COMPOSITION FOR BONDING SEMICONDUCTORS, ADHESIVE FILM FOR SEMICONDUCTOR USING THE SAME, DICING DIE BONDING FILM, AND METHOD FOR DICING SEMICONDUCTOR WAFER
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Assignee
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| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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Correspondence name and address
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ROTHWELL, FIGG, ERNST & MANBECK, P.C.
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607 14TH STREET, N.W., SUITE 800
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WASHINGTON, DC 20005
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09/22/2024 04:57 PM
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