Patent Assignment Details
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Reel/Frame: | 055951/0001 | |
| Pages: | 4 |
| | Recorded: | 04/17/2021 | | |
Attorney Dkt #: | SAM-59116 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/03/2023
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Application #:
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17225178
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Filing Dt:
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04/08/2021
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Publication #:
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Pub Dt:
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03/31/2022
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Title:
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FAN-OUT SEMICONDUCTOR PACKAGE INCLUDING UNDER-BUMP METALLURGY
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Assignee
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129, SAMSUNG-RO, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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Correspondence name and address
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MUIR PATENT LAW, PLLC
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P.O. BOX 1213
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GREAT FALLS, VA 22066
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09/25/2024 12:13 PM
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