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Total properties:
24
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Patent #:
|
|
Issue Dt:
|
02/28/2023
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Application #:
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17220661
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Filing Dt:
|
04/01/2021
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|
Publication #:
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Pub Dt:
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07/22/2021
| | | | |
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Title:
|
ASSEMBLY PROCESSES FOR SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING SPACER WITH EMBEDDED SEMICONDUCTOR DIE
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|
|
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Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
17237383
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Filing Dt:
|
04/22/2021
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|
Publication #:
|
|
Pub Dt:
|
11/04/2021
| | | | |
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Title:
|
WIRELESS COMMUNICATION WITH CODED DATA FRAMES
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|
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Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
17237421
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Filing Dt:
|
04/22/2021
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|
Publication #:
|
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Pub Dt:
|
11/04/2021
| | | | |
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Title:
|
WIRELESS COMMUNICATION USING MULTIPLE FREQUENCIES SEGMENTS
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|
|
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Patent #:
|
|
Issue Dt:
|
05/09/2023
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Application #:
|
17237469
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Filing Dt:
|
04/22/2021
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|
Publication #:
|
|
Pub Dt:
|
11/04/2021
| | | | |
|
Title:
|
SPATIAL REUSE IN WIRELESS COMMUNICATION
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|
|
|
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Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
17237510
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Filing Dt:
|
04/22/2021
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|
Publication #:
|
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Pub Dt:
|
11/04/2021
| | | | |
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Title:
|
RETRANSMISSION OF WIRELESS DATA
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/29/2022
|
Application #:
|
17301393
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Filing Dt:
|
04/01/2021
|
|
Publication #:
|
|
Pub Dt:
|
02/24/2022
| | | | |
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Title:
|
CURRENT BALANCING FOR INTERLEAVED POWER CONVERTERS
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17302119
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Filing Dt:
|
04/23/2021
|
|
Publication #:
|
|
Pub Dt:
|
08/05/2021
| | | | |
|
Title:
|
METHODS AND APPARATUS FOR A POWER SUPPLY CONTROL CIRCUIT
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17302836
|
Filing Dt:
|
05/13/2021
|
|
Publication #:
|
|
Pub Dt:
|
11/17/2022
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANCHE DIODES AND ISOLATION STRUCTURES
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/21/2023
|
Application #:
|
17304132
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Filing Dt:
|
06/15/2021
|
|
Publication #:
|
|
Pub Dt:
|
03/03/2022
| | | | |
|
Title:
|
DIFFERENTIAL OPERATIONAL TRANSCONDUCTANCE AMPLIFIER FOR CHOPPER-STABILIZED AMPLIFICATION
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17304136
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Filing Dt:
|
06/15/2021
|
|
Publication #:
|
|
Pub Dt:
|
09/30/2021
| | | | |
|
Title:
|
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17304715
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Filing Dt:
|
06/24/2021
|
|
Publication #:
|
|
Pub Dt:
|
10/21/2021
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/19/2023
|
Application #:
|
17304769
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Filing Dt:
|
06/25/2021
|
|
Publication #:
|
|
Pub Dt:
|
12/29/2022
| | | | |
|
Title:
|
VOLTAGE REFERENCE WITH TEMPERATURE-SELECTIVE SECOND-ORDER TEMPERATURE COMPENSATION
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17304792
|
Filing Dt:
|
06/25/2021
|
|
Publication #:
|
|
Pub Dt:
|
10/14/2021
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGES AND RELATED METHODS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17306396
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Filing Dt:
|
05/03/2021
|
|
Publication #:
|
|
Pub Dt:
|
08/19/2021
| | | | |
|
Title:
|
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/28/2023
|
Application #:
|
17315671
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Filing Dt:
|
05/10/2021
|
|
Publication #:
|
|
Pub Dt:
|
08/26/2021
| | | | |
|
Title:
|
POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17316367
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Filing Dt:
|
05/10/2021
|
|
Publication #:
|
|
Pub Dt:
|
08/26/2021
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE AND RELATED METHODS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/27/2023
|
Application #:
|
17317137
|
Filing Dt:
|
05/11/2021
|
|
Publication #:
|
|
Pub Dt:
|
03/17/2022
| | | | |
|
Title:
|
RECEIVE PATH IN-PHASE AND QUADRATURE IMBALANCE CORRECTION USING CIRCUIT NOISE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/16/2023
|
Application #:
|
17320068
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Filing Dt:
|
05/13/2021
|
|
Publication #:
|
|
Pub Dt:
|
11/17/2022
| | | | |
|
Title:
|
UPLINK ERROR RATE
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17320495
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Filing Dt:
|
05/14/2021
|
|
Publication #:
|
|
Pub Dt:
|
09/02/2021
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH BACKMETAL AND RELATED METHODS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/12/2023
|
Application #:
|
17320582
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Filing Dt:
|
05/14/2021
|
|
Publication #:
|
|
Pub Dt:
|
09/02/2021
| | | | |
|
Title:
|
JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/29/2023
|
Application #:
|
17336053
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Filing Dt:
|
06/01/2021
|
|
Publication #:
|
|
Pub Dt:
|
09/23/2021
| | | | |
|
Title:
|
CLIENT STEERING FOR A WIRELESS LOCAL AREA NETWORK
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/05/2023
|
Application #:
|
17338407
|
Filing Dt:
|
06/03/2021
|
|
Publication #:
|
|
Pub Dt:
|
09/23/2021
| | | | |
|
Title:
|
RECONFIGURABLE MIMO RADAR
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17338526
|
Filing Dt:
|
06/03/2021
|
|
Publication #:
|
|
Pub Dt:
|
10/14/2021
| | | | |
|
Title:
|
AMPLIFIERS SUITABLE FOR MM-WAVE SIGNAL SPLITTING AND COMBINING
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17344082
|
Filing Dt:
|
06/10/2021
|
|
Publication #:
|
|
Pub Dt:
|
09/30/2021
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE STRUCTURE AND RELATED METHODS
|
|
