Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 025659/0006 | |
| Pages: | 10 |
| | Recorded: | 01/19/2011 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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07/20/2010
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Application #:
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12003689
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Filing Dt:
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12/31/2007
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Publication #:
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Pub Dt:
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07/02/2009
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Title:
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MULTI-WAVELENGTH LED ARRAY PACKAGE MODULE AND METHOD FOR PACKAGING THE SAME
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Patent #:
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Issue Dt:
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11/02/2010
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Application #:
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12076457
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Filing Dt:
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03/19/2008
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Publication #:
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Pub Dt:
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09/24/2009
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Title:
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OVER-VOLTAGE PROTECTION DEVICE
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Patent #:
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Issue Dt:
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08/17/2010
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Application #:
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12078692
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Filing Dt:
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04/04/2008
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Publication #:
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Pub Dt:
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07/02/2009
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Title:
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MULTI-WAVELENGTH LIGHT-EMITTING MODULE WITH HIGH DENSITY ELECTRICAL CONNECTIONS
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Patent #:
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Issue Dt:
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10/19/2010
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Application #:
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12216397
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Filing Dt:
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07/03/2008
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Publication #:
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Pub Dt:
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01/07/2010
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Title:
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EMBEDDED PACKAGE STRUCTURE MODULE WITH HIGH-DENSITY ELECTRICAL CONNECTIONS AND METHOD FOR MAKING THE SAME
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Assignees
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| NO. 1558, ZHANG DONG ROAD, ZHANGJIANG HI-TECH PARK |
| SHANGHAI, CHINA 201203 |
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| 141, LANE 351, SEC. 1, TAIPING ROAD, TSAOTUEN, |
| NANTOU, TAIWAN 54261 |
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Correspondence name and address
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HDLS IPR SERVICES
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P.O. BOX. 220746
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CHANTILLY, VA 20153
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