Patent Assignment Details
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| Reel/Frame: | 013590/0007 | |
| Pages: | 7 |
| | Recorded: | 12/16/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/12/2006
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Application #:
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10320263
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Filing Dt:
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12/16/2002
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Publication #:
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Pub Dt:
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06/17/2004
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Title:
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PLATING SOLUTIONS FOR ELECTROCHEMICAL OR CHEMICAL DEPOSITION OF COPPER INTERCONNECTS AND METHODS THEREFOR
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Assignee
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| P.O. BOX 33427 |
| ST. PAUL, MINNESOTA 55133-3427 |
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Correspondence name and address
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3M INNOVATIVE PROPERTIES COMPANY
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PO BOX 33427
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ST. PAUL, MN 55133-3427
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