Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 013998/0007 | |
| Pages: | 3 |
| | Recorded: | 09/23/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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11/21/2000
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Application #:
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09250519
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Filing Dt:
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02/16/1999
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Title:
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MICROMECHANICAL SYSTEM FABRICATION METHOD USING (111) SINGLE CRYSTALLINE SILICON
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Patent #:
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Issue Dt:
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02/10/2004
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Application #:
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09715446
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Filing Dt:
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11/17/2000
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Title:
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MICROMECHANICAL SYSTEM FABRICATION METHOD USING (111) SINGLE CRYSTALLINE SILICON
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Patent #:
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Issue Dt:
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10/29/2002
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Application #:
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09756981
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Filing Dt:
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01/09/2001
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Publication #:
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Pub Dt:
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08/16/2001
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Title:
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ISOLATION IN MICROMACHINED SINGLE CRYSTAL SILICON USING DEEP TRENCH INSULATION
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Patent #:
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Issue Dt:
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05/27/2003
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Application #:
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09885832
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Filing Dt:
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06/19/2001
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Publication #:
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Pub Dt:
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01/03/2002
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Title:
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TRIPLE LAYER ISOLATION FOR SILICON MICROSTRUCTURE AND STRUCTURES FORMED USING THE SAME
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Assignee
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| TAEWHA VILLA #302 |
| BANGBAE-4-DONG 805-4 SEOCHO-GU |
| SEOUL 37-831, KOREA, REPUBLIC OF |
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Correspondence name and address
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JAY A. BONDELL, ESQ.
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292 MADISON AVENUE, 19TH FLOOR
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NEW YORK, NEW YORK 10017
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