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Patent Assignment Details
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Reel/Frame:057334/0008   Pages: 4
Recorded: 08/31/2021
Attorney Dkt #:TW1024/1359
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 4
1
Patent #:
Issue Dt:
11/19/2013
Application #:
13670438
Filing Dt:
11/06/2012
Publication #:
Pub Dt:
06/20/2013
Title:
SEMICONDUCTOR PACKAGE STRUCTURE
2
Patent #:
Issue Dt:
09/09/2014
Application #:
13687120
Filing Dt:
11/28/2012
Publication #:
Pub Dt:
06/13/2013
Title:
LIGHT EMITTING DIODE AND FLIP-CHIP LIGHT EMITTING DIODE PACKAGE
3
Patent #:
Issue Dt:
10/28/2014
Application #:
13917646
Filing Dt:
06/14/2013
Publication #:
Pub Dt:
06/12/2014
Title:
LIGHT-EMITTING DEVICE CAPABLE OF IMPROVING THE LIGHT-EMITTING EFFICIENCY
4
Patent #:
Issue Dt:
10/16/2018
Application #:
15721675
Filing Dt:
09/29/2017
Title:
NITRIDE SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING THE SAME
Assignor
1
Exec Dt:
08/26/2021
Assignees
1
NO. 31, SEC. 2, HUANDONG RD., SHANHUA DIST.,
TAINAN CITY, TAIWAN 741014
2
22F., NO.392, RUEY KUANG RD., NEIHU,
TAIPEI, TAIWAN 11492
Correspondence name and address
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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