Patent Assignment Details
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Reel/Frame: | 060691/0008 | |
| Pages: | 4 |
| | Recorded: | 08/02/2022 | | |
Attorney Dkt #: | TWT08870/US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/23/2023
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Application #:
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17815950
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Filing Dt:
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07/29/2022
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Title:
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METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION STRUCTURE
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Assignees
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NO. 10, LI-HSIN 6TH ROAD, HSINCHU SCIENCE PARK |
HSINCHU CITY, TAIWAN 30078 |
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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CKC & PARTNERS CO., LLC
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12345 LAKE CITY WAY NE, NO. 283
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SEATTLE, WA 98125
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06/17/2024 06:40 PM
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