Patent Assignment Details
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| Reel/Frame: | 017907/0009 | |
| Pages: | 6 |
| | Recorded: | 03/10/2006 | | |
| Attorney Dkt #: | 1030681-000828 |
| Conveyance: | RE-RECORD TO CORRECT NAMES AND ADDRESSES OF THE ASSIGNEES PREVIOUSLY RECORDED ON REEL 016789 FRAME 0537. ASSIGNOR CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11183908
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Filing Dt:
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07/19/2005
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Publication #:
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Pub Dt:
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05/11/2006
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Title:
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Method of forming electrode for compound semiconductor device
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Assignees
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| 314, MAETAN 3-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| 1 ORYONG-DONG, BUK-GU |
| GWANGJU-SI, KOREA, REPUBLIC OF |
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Correspondence name and address
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BUCHANAN INGERSOLL PC
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POST OFFICE BOX 1404
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ALEXANDRIA, VA 22313-1404
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