Patent Assignment Details
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| Reel/Frame: | 007493/0010 | |
| Pages: | 3 |
| | Recorded: | 05/24/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/11/1998
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Application #:
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08448757
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Filing Dt:
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05/24/1995
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Title:
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ASSEMBLY INCLUDING FINE-PITCH SOLDER BUMPING AND METHOD OF FORMING
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Assignee
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| 7444 WEST WILSON AVENUE |
| CHICAGO, ILLINOIS 60656 |
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Correspondence name and address
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DAVID L. NEWMAN, ESQ.
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METHODE ELECTRONICS, INC.
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PATENT DEPARTMENT
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7444 WEST WILSON AVENUE
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CHICAGO, IL 60656
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