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Patent Assignment Details
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Reel/Frame:016732/0011   Pages: 2
Recorded: 06/25/2005
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/04/2008
Application #:
11166655
Filing Dt:
06/25/2005
Publication #:
Pub Dt:
12/28/2006
Title:
PACKAGING OF SMD LIGHT EMITTING DIODES
Assignor
1
Exec Dt:
06/20/2005
Assignee
1
NO. 195, SEC. 4, CHUNG HSING ROD, CHUTUNG
HSINCHU, TAIWAN
Correspondence name and address
JASON Z. LIN
SUPREME PATENT SERVICES
P.O. BOX 2339
SARATOGA, CA 95070

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