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Patent Assignment Details
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Reel/Frame:054060/0011   Pages: 2
Recorded: 10/15/2020
Attorney Dkt #:67617-010
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
06/04/2019
Application #:
15643493
Filing Dt:
07/07/2017
Publication #:
Pub Dt:
01/11/2018
Title:
PACKAGING UNIT FOR LIQUID SAMPLE LOADING DEVICES APPLIED IN ELECTRON MICROSCOPE AND PACKAGING METHOD
2
Patent #:
Issue Dt:
06/16/2020
Application #:
16199668
Filing Dt:
11/26/2018
Publication #:
Pub Dt:
05/07/2020
Title:
CHIP PACKAGING DEVICE AND ALIGNMENT BONDING METHOD THEREOF
Assignor
1
Exec Dt:
10/14/2020
Assignee
1
12F., NO. 65, GONGYUAN S. RD., NORTH DIST.
TAINAN CITY, TAIWAN 704
Correspondence name and address
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
8230 BOONE BLVD, SUITE 405
VIENNA, VA 22182

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