Patent Assignment Details
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Reel/Frame: | 055737/0012 | |
| Pages: | 3 |
| | Recorded: | 03/26/2021 | | |
Attorney Dkt #: | TSMP20172233US02 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17195211
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Filing Dt:
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03/08/2021
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Publication #:
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Pub Dt:
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06/24/2021
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Title:
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Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition
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Assignee
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SLATER MATSIL, LLP/TSMC
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17950 PRESTON ROAD, SUITE 1000
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DALLAS, TX 75252
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09/26/2024 10:09 AM
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