Patent Assignment Details
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Reel/Frame: | 055350/0013 | |
| Pages: | 4 |
| | Recorded: | 02/22/2021 | | |
Attorney Dkt #: | B05-21-P27-USI |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/02/2022
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Application #:
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17181039
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Filing Dt:
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02/22/2021
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Title:
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Double-sided and Multilayer Flexible Printed Circuit (FPC) Substrate and Method of Processing the Same
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Assignee
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NO. 2288, LUHENG ROAD, ECONOMIC DEVELOPMENT ZONE |
CHANGZHOU CITY, JIANGSU PROVINCE, CHINA |
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Correspondence name and address
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MAYER & WILLIAMS, P.C.
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55 MADISON AVENUE, SUITE 400
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MORRISTOWN, NJ 07960
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09/25/2024 04:08 PM
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