Patent Assignment Details
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Reel/Frame: | 030308/0014 | |
| Pages: | 6 |
| | Recorded: | 04/29/2013 | | |
Attorney Dkt #: | 2162.195582/BD146D |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/30/2014
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Application #:
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13739130
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Filing Dt:
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01/11/2013
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Publication #:
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Pub Dt:
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07/17/2014
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Title:
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SEMICONDUCTOR DEVICE COMPRISING METALLIZATION LAYERS OF REDUCED INTERLAYER CAPACITANCE BY REDUCING THE AMOUNT OF ETCH STOP MATERIALS
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Assignee
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P.O. BOX 309 |
UGLAND HOUSE |
GRAND CAYMAN, CAYMAN ISLANDS KY1-1104 |
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Correspondence name and address
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GLOBALFOUNDRIES INC. C/O WILLIAMS, MORGA
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10333 RICHMOND , SUITE 1100
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HOUSTON, TX 77042
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