Patent Assignment Details
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| Reel/Frame: | 012451/0015 | |
| Pages: | 2 |
| | Recorded: | 10/19/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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10037062
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Filing Dt:
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10/19/2001
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Publication #:
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Pub Dt:
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08/01/2002
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Title:
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DIE FOR DIE COMPACTING OF POWDERED MATERIAL
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Assignee
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| 520, MINORIDAI, MATSUDO-SHI |
| CHIBA, JAPAN |
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Correspondence name and address
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KILPATRICK STOCKTON LLP
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JOHN S. PRATT
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SUITE 2800
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1100 PEACHTREE STREET
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ATLANTA, GA 30309-4530
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