Patent Assignment Details
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| Reel/Frame: | 026191/0016 | |
| Pages: | 3 |
| | Recorded: | 04/28/2011 | | |
| Attorney Dkt #: | US34802 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/06/2012
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Application #:
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13095877
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Filing Dt:
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04/28/2011
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Publication #:
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Pub Dt:
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12/22/2011
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Title:
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METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD WITH PLATED THROUGH HOLES
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Assignees
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| XINYUAN INDUSTRIAL ZONE, TANGWEI VILLAGE,FUYONG TOWN, BAO' AN DISTRICT |
| SHENZHEN CITY, GUANGDONG PROVINCE, CHINA |
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| NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE |
| TAYUAN, TAOYUAN, TAIWAN |
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Correspondence name and address
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RAYMOND J. CHEW
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288 SOUTH MAYO AVENUE
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CITY OF INDUSTRY, CA 91789
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