Patent Assignment Details
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| Reel/Frame: | 030891/0016 | |
| Pages: | 3 |
| | Recorded: | 07/29/2013 | | |
| Attorney Dkt #: | 6101.041US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/16/2017
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Application #:
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13950335
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Filing Dt:
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07/25/2013
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Publication #:
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Pub Dt:
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01/29/2015
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Title:
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METHOD OF FABRICATION OF ENCAPSULATED ELECTRONICS DEVICES MOUNTED ON A REDISTRIBUTION LAYER
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Assignee
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| NO.2, RESEARCH & DEVELOPMENT 2ND RD., SCIENCE PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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MIN-LEE TENG
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7F-2, NO. 79, SEC.2, ROOSEVELT RD.
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TAIPEI, TAIWAN
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