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Reel/Frame:033232/0016   Pages: 3
Recorded: 06/24/2014
Attorney Dkt #:11-TPY-0828US01
Conveyance: CORRECTIVE/CONFIRMING ASSIGNMENT
Total properties: 1
1
Patent #:
Issue Dt:
08/05/2014
Application #:
13335467
Filing Dt:
12/22/2011
Publication #:
Pub Dt:
06/27/2013
Title:
WINDOW CLAMP TOP PLATE FOR INTEGRATED CIRCUIT PACKAGING
Assignors
1
Exec Dt:
06/24/2014
2
Exec Dt:
06/24/2014
3
Exec Dt:
06/24/2014
Assignee
1
28 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE
Correspondence name and address
BARRY DOVE
750 CANYON DRIVE SUITE 300
COPPELL, TX 75009

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