Patent Assignment Details
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Reel/Frame: | 018383/0021 | |
| Pages: | 3 |
| | Recorded: | 10/04/2006 | | |
Attorney Dkt #: | 790_085 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/28/2009
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Application #:
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11503847
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Filing Dt:
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08/14/2006
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Publication #:
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Pub Dt:
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03/01/2007
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Title:
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METHOD FOR ENCAPSULATING A COMPONENT, ESPECIALLY AN ELECTRIC OR ELECTRONIC COMPONENT, BY MEANS OF AN IMPROVED SOLDER SEAM
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Assignee
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25, RUE LEBLANC |
IMMEUBLE "LE PONTANT D" |
75015 PARIS, FRANCE |
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Correspondence name and address
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STEPHEN & BROWN
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P.O. BOX 7068
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SYRACUSE, NY 13261-7068
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