Patent Assignment Details
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| Reel/Frame: | 039497/0021 | |
| Pages: | 3 |
| | Recorded: | 08/22/2016 | | |
| Attorney Dkt #: | MOH-BAASE-012 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15224831
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Filing Dt:
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08/01/2016
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Publication #:
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Pub Dt:
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11/24/2016
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Title:
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Method for removing dielectric layers from semiconductor components by using a laser beam
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Assignee
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| PETERSBRUNNER STR. 1B |
| STARNBERG, GERMANY D-82319 |
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Correspondence name and address
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LERNER GREENBERG STEMER LLP
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P.O. BOX 2480
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HOLLYWOOD, FL 33022-2480
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