Patent Assignment Details
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| Reel/Frame: | 059871/0023 | |
| Pages: | 4 |
| | Recorded: | 05/09/2022 | | |
| Attorney Dkt #: | P220353US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/16/2024
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Application #:
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17775421
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Filing Dt:
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05/09/2022
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Publication #:
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Pub Dt:
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11/24/2022
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Title:
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DISSIMILAR MATERIAL SOLID PHASE BONDING METHOD, DISSIMILAR MATERIAL SOLID PHASE BONDED STRUCTURE, AND DISSIMILAR MATERIAL SOLID PHASE BONDING DEVICE
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Assignee
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| 1-1, YAMADAOKA |
| SUITA-SHI, OSAKA, JAPAN 565-0871 |
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Correspondence name and address
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WESTERMAN, HATTORI, DANIELS & ADRIAN, LLP
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8500 LEESBURG PIKE
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SUITE 7500
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TYSONS, VA 22182
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05/26/2024 01:35 AM
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