Patent Assignment Details
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Reel/Frame: | 018324/0024 | |
| Pages: | 3 |
| | Recorded: | 09/14/2006 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10592967
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Filing Dt:
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09/14/2006
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Publication #:
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Pub Dt:
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09/25/2008
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Title:
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Dielectric Paste for a Multi-Layered Ceramic Electronic Component and a Method for Manufacturing a Multi-Layered Unit for a Multi-Layered Ceramic Electronic Component
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Assignee
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1-13-1, NIHONBASHI, CHUO-KU |
TOKYO, JAPAN 103-8272 |
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Correspondence name and address
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SEED INTELLECTUAL PROP. LAW GROUP, PLLC
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DAVID V. CARLSON
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701 FIFTH AVENUE
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SUITE 6300
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SEATTLE, WA 98104-7092
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09/22/2024 06:04 PM
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