Patent Assignment Details
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Reel/Frame: | 029277/0024 | |
| Pages: | 3 |
| | Recorded: | 11/12/2012 | | |
Attorney Dkt #: | P6567US00 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/29/2014
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Application #:
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13674096
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Filing Dt:
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11/12/2012
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Publication #:
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Pub Dt:
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05/15/2014
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Title:
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THROUGH-SILICON VIA STRUCTURE WITH PATTERNED SURFACE, PATTERNED SIDEWALL AND LOCAL ISOLATION
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Assignee
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3/F, BUILDING 6, 2 SCIENCE PARK WEST AVENUE |
HONG KONG SCIENCE PARK, SHATIN, N.T. |
HONG KONG, HONG KONG |
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Correspondence name and address
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ELLA CHEONG HONG KONG
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5001 HOPEWELL CENTRE
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183 QUEEN'S ROAD EAST, WAN CHAI
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HONG KONG, HONG KONG
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