Patent Assignment Details
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Reel/Frame: | 010412/0025 | |
| Pages: | 2 |
| | Recorded: | 03/15/1999 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/14/2001
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Application #:
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09254657
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Filing Dt:
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03/15/1999
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Title:
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THERMOELECTRIC SEMICONDUCTOR MATERIAL, MANUFACTURE PROCESS THEREFOR, AND MEHTOD OF HOT FORGING THERMOELECTRIC MODULE USING THE SAME
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Assignees
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3-6 AKASAKA 2-CHOME |
MINATO-KU, TOKYO 107-8414, JAPAN |
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2597, SHINOMIYA, HIRATSUKA-SHI |
KANAGAWA 254-0014, JAPAN |
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Correspondence name and address
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VARNDELL LEGAL GROUP
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R. EUGENE VARNDELL, JR.
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1150 S. WASHINGTON STREET
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SUITE 220
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ALEXANDRIA, VA 22314
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