Patent Assignment Details
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Reel/Frame: | 006474/0027 | |
| Pages: | 2 |
| | Recorded: | 03/11/1993 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/11/1995
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Application #:
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08029465
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Filing Dt:
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03/11/1993
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Title:
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DOUBLE TYPE MOUNT STRUCTURE FOR MOUNTING ELECTRONIC CIRCUIT PACKAGE
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Assignee
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1015 KAMIKODANAKA, NAKAHARA-KU |
KAWASAKI-SHI, KANAGAWA, JAPAN 211 |
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Correspondence name and address
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HELFGOTT & KARAS, P.C.
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SAMSON HELFGOTT
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EMPIRE STATE BUILDING
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60TH FLOOR
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NEW YORK, NEW YORK 10118
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