Patent Assignment Details
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| Reel/Frame: | 020833/0027 | |
| Pages: | 3 |
| | Recorded: | 04/19/2008 | | |
| Attorney Dkt #: | 10122191 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/28/2010
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Application #:
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12102439
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Filing Dt:
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04/14/2008
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Publication #:
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Pub Dt:
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07/16/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE AND FABRICATING METHOD THEREOF
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Assignee
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| 2F, NO. 23, LI-HSIN RD. |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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QUINTERO LAW OFFICE
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2210 MAIN STREET, SUITE 200
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SANTA MONICA, CA 90405
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