Total properties:
38
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Patent #:
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Issue Dt:
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03/14/2006
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Application #:
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10793574
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Filing Dt:
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03/04/2004
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Publication #:
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Pub Dt:
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12/30/2004
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Title:
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COAXIAL WAVEGUIDE MICROSTRUCTURES AND METHODS OF FORMATION THEREOF
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Patent #:
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Issue Dt:
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10/31/2006
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Application #:
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10941667
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Filing Dt:
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09/15/2004
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Publication #:
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Pub Dt:
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05/26/2005
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Title:
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DEVICE PACKAGE AND METHOD FOR THE FABRICATION AND TESTING THEREOF
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Patent #:
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Issue Dt:
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02/12/2008
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Application #:
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10941668
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Filing Dt:
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09/15/2004
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Publication #:
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Pub Dt:
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05/26/2005
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Title:
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DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF
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Patent #:
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Issue Dt:
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12/12/2006
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Application #:
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11316417
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Filing Dt:
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12/22/2005
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Publication #:
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Pub Dt:
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07/27/2006
| | | | |
Title:
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COAXIAL WAVEGUIDE MICROSTRUCTURES HAVING AN ACTIVE DEVICE AND METHODS OF FORMATION THEREOF
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Patent #:
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Issue Dt:
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02/15/2011
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Application #:
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11590099
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Filing Dt:
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10/31/2006
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Publication #:
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Pub Dt:
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02/22/2007
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Title:
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DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF
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Patent #:
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Issue Dt:
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03/24/2009
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Application #:
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11590629
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Filing Dt:
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10/31/2006
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Publication #:
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Pub Dt:
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03/29/2007
| | | | |
Title:
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DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF
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Patent #:
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Issue Dt:
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07/29/2008
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Application #:
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11637629
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Filing Dt:
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12/12/2006
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Publication #:
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Pub Dt:
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07/05/2007
| | | | |
Title:
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COAXIAL WAVEGUIDE MICROSTRUCTURES HAVING AN ACTIVE DEVICE AND METHODS OF FORMATION THEREOF
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Patent #:
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Issue Dt:
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01/19/2010
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Application #:
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12005885
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Filing Dt:
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12/28/2007
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Publication #:
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Pub Dt:
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08/14/2008
| | | | |
Title:
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THREE-DIMENSIONAL MICROSTRUCTURES HAVING AN EMBEDDED AND MECHANICALLY LOCKED SUPPORT MEMBER AND METHOD OF FORMATION THEREOF
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Patent #:
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Issue Dt:
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02/02/2010
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Application #:
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12005936
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Filing Dt:
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12/28/2007
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Publication #:
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Pub Dt:
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08/21/2008
| | | | |
Title:
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THREE-DIMENSIONAL MICROSTRUCTURES HAVING AN EMBEDDED SUPPORT MEMBER WITH AN APERTURE THEREIN AND METHOD OF FORMATION THEREOF
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Patent #:
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Issue Dt:
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03/01/2011
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Application #:
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12077546
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Filing Dt:
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03/20/2008
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Publication #:
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Pub Dt:
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10/09/2008
| | | | |
Title:
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COAXIAL TRANSMISSION LINE MICROSTRUCTURES AND METHODS OF FORMATION THEREOF
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Patent #:
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Issue Dt:
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07/13/2010
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Application #:
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12077547
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Filing Dt:
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03/20/2008
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Publication #:
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Pub Dt:
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10/02/2008
| | | | |
Title:
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INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
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|
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Patent #:
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Issue Dt:
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10/04/2011
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Application #:
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12608870
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Filing Dt:
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10/29/2009
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Publication #:
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Pub Dt:
|
05/06/2010
| | | | |
Title:
|
THREE-DIMENSIONAL MICROSTRUCTURES AND METHODS OF FORMATION THEREOF
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|
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Patent #:
|
|
Issue Dt:
|
04/22/2014
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Application #:
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12944040
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Filing Dt:
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11/11/2010
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Publication #:
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Pub Dt:
|
04/07/2011
| | | | |
Title:
|
DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF
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|
|
Patent #:
|
|
Issue Dt:
|
05/06/2014
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Application #:
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13011889
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Filing Dt:
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01/22/2011
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Publication #:
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|
Pub Dt:
|
07/28/2011
| | | | |
Title:
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THERMAL MANAGEMENT
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|
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Patent #:
|
|
Issue Dt:
|
09/24/2013
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Application #:
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13015671
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Filing Dt:
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01/28/2011
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Publication #:
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Pub Dt:
|
11/10/2011
| | | | |
Title:
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A COAXIAL TRANSMISSION LINE MICROSTRUCTURE INCLUDING AN ENLARGED COAXIAL STRUCTURE FOR TRANSITIONING TO AN ELECTRICAL CONNECTOR
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|
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Patent #:
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Issue Dt:
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06/03/2014
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Application #:
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13085124
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Filing Dt:
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04/12/2011
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Publication #:
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|
Pub Dt:
|
09/01/2011
| | | | |
Title:
|
COAXIAL WAVEGUIDE MICROSTRUCTURES HAVING AN ACTIVE DEVICE AND METHODS OF FORMATION THEREOF
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|
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Patent #:
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Issue Dt:
|
04/15/2014
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Application #:
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13176740
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Filing Dt:
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07/05/2011
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Publication #:
|
|
Pub Dt:
|
03/15/2012
| | | | |
Title:
|
THREE-DIMENSIONAL MICROSTRUCTURES
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|
|
Patent #:
|
|
Issue Dt:
|
07/21/2015
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Application #:
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13183409
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Filing Dt:
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07/14/2011
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Publication #:
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Pub Dt:
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01/17/2013
| | | | |
Title:
|
HOLLOW CORE COAXIAL CABLES AND METHODS OF MAKING THE SAME
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|
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Patent #:
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|
Issue Dt:
|
01/13/2015
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Application #:
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13219736
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Filing Dt:
|
08/29/2011
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Publication #:
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Pub Dt:
|
07/26/2012
| | | | |
Title:
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THREE-DIMENSIONAL MICROSTRUCTURES HAVING A RE-ENTRANT SHAPE APERTURE AND METHODS OF FORMATION
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|
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Patent #:
|
|
Issue Dt:
|
03/03/2015
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Application #:
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13237931
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Filing Dt:
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09/20/2011
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Publication #:
|
|
Pub Dt:
|
03/22/2012
| | | | |
Title:
|
DEVICE PACKAGE AND METHODS FOR THE FABRICATION THEREOF
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|
|
Patent #:
|
|
Issue Dt:
|
10/21/2014
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Application #:
|
13488991
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Filing Dt:
|
06/05/2012
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Title:
|
DEVICES AND METHODS FOR SOLDER FLOW CONTROL IN THREE-DIMENSIONAL MICROSTRUCTURES
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|
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Patent #:
|
|
Issue Dt:
|
08/26/2014
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Application #:
|
13490089
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Filing Dt:
|
06/06/2012
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Title:
|
BATCH FABRICATED MICROCONNECTORS
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|
|
Patent #:
|
|
Issue Dt:
|
02/10/2015
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Application #:
|
13712676
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Filing Dt:
|
12/12/2012
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Title:
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SMART POWER COMBINER
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|
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Patent #:
|
|
Issue Dt:
|
06/23/2015
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Application #:
|
13726073
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Filing Dt:
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12/22/2012
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Title:
|
HIGH FREQUENCY POWER COMBINER/DIVIDER
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|
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Patent #:
|
|
Issue Dt:
|
05/05/2015
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Application #:
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13733565
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Filing Dt:
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01/03/2013
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Publication #:
|
|
Pub Dt:
|
10/31/2013
| | | | |
Title:
|
INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
13965524
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Filing Dt:
|
08/13/2013
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Publication #:
|
|
Pub Dt:
|
12/19/2013
| | | | |
Title:
|
MULTILAYER BUILD PROCESSES AND DEVICES THEREOF
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|
|
Patent #:
|
|
Issue Dt:
|
04/07/2015
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Application #:
|
14029252
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Filing Dt:
|
09/17/2013
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Publication #:
|
|
Pub Dt:
|
01/16/2014
| | | | |
Title:
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COAXIAL TRANSMISSION LINE MICROSTRUCTURE WITH A PORTION OF INCREASED TRANSVERSE DIMENSION AND METHOD OF FORMATION THEREOF
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|
|
Patent #:
|
|
Issue Dt:
|
04/05/2016
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Application #:
|
14211407
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Filing Dt:
|
03/14/2014
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Title:
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SUBSTRATE-FREE MECHANICAL INTERCONNECTION OF ELECTRONIC SUB-SYSTEMS USING A SPRING CONFIGURATION
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|
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Patent #:
|
|
Issue Dt:
|
04/05/2016
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Application #:
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14211749
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Filing Dt:
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03/14/2014
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Title:
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A MICROSTRUCTURE INCLUDING MICROSTRUCTURAL WAVEGUIDE ELEMENTS AND/OR IC CHIPS THAT ARE MECHANICALLY INTERCONNECTED TO EACH OTHER
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|
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Patent #:
|
|
Issue Dt:
|
06/12/2018
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Application #:
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14232396
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Filing Dt:
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05/05/2014
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Publication #:
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Pub Dt:
|
08/21/2014
| | | | |
Title:
|
METHODS OF FABRICATING ELECTRONIC AND MECHANICAL STRUCTURES
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|
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Patent #:
|
|
Issue Dt:
|
09/15/2015
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Application #:
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14253061
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Filing Dt:
|
04/15/2014
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Publication #:
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Pub Dt:
|
08/07/2014
| | | | |
Title:
|
THREE-DIMENSIONAL MICROSTRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/31/2015
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Application #:
|
14258358
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Filing Dt:
|
04/22/2014
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Publication #:
|
|
Pub Dt:
|
08/14/2014
| | | | |
Title:
|
DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2016
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Application #:
|
14293696
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Filing Dt:
|
06/02/2014
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Publication #:
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|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
Coaxial Waveguide Microstructure Having Center and Outer Conductors Configured in a Rectangular Cross-Section
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|
|
Patent #:
|
|
Issue Dt:
|
02/28/2017
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Application #:
|
14468863
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Filing Dt:
|
08/26/2014
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Publication #:
|
|
Pub Dt:
|
12/11/2014
| | | | |
Title:
|
BATCH FABRICATED MICROCONNECTORS
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|
|
Patent #:
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|
Issue Dt:
|
11/29/2016
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Application #:
|
14494716
|
Filing Dt:
|
09/24/2014
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Publication #:
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|
Pub Dt:
|
01/08/2015
| | | | |
Title:
|
Devices and Methods for Solder Flow Control in Three-Dimensional Microstructures
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|
|
Patent #:
|
|
Issue Dt:
|
12/06/2016
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Application #:
|
14563018
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Filing Dt:
|
12/08/2014
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Publication #:
|
|
Pub Dt:
|
11/17/2016
| | | | |
Title:
|
A THREE-DIMENSIONAL MICROSTRUCTURE HAVING A FIRST DIELECTRIC ELEMENT AND A SECOND MULTI-LAYER METAL ELEMENT CONFIGURED TO DEFINE A NON-SOLID VOLUME
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
14601629
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Filing Dt:
|
01/21/2015
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Publication #:
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|
Pub Dt:
|
11/12/2015
| | | | |
Title:
|
DEVICE PACKAGE AND METHODS FOR THE FABRICATION THEREOF
|
|
|
Patent #:
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|
Issue Dt:
|
06/19/2018
|
Application #:
|
14695298
|
Filing Dt:
|
04/24/2015
|
Publication #:
|
|
Pub Dt:
|
08/13/2015
| | | | |
Title:
|
INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
|
|