Patent Assignment Details
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Reel/Frame: | 017904/0028 | |
| Pages: | 3 |
| | Recorded: | 05/16/2006 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/31/2009
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Application #:
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11434951
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Filing Dt:
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05/16/2006
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Publication #:
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Pub Dt:
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10/25/2007
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Title:
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DIELECTRIC PLASMA ETCH PROCESS WITH IN-SITU AMORPHOUS CARBON MASK WITH IMPROVED CRITICAL DIMENSION AND ETCH SELECTIVITY
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Assignee
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P.O. BOX 450A |
LEGAL AFFAIRS DEPT., M/S 2061-LEGAL |
SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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ROBERT M. WALLACE
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LAW OFFICE OF ROBERT M. WALLACE
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2112 EASTMAN AVENUE, SUITE 102
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VENTURA, CA 93003
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