Patent Assignment Details
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Reel/Frame: | 020787/0031 | |
| Pages: | 3 |
| | Recorded: | 04/02/2008 | | |
Attorney Dkt #: | 2557-000952/U |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/23/2011
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Application #:
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12078598
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Filing Dt:
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04/02/2008
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Publication #:
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Pub Dt:
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10/02/2008
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Title:
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SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE MOLD
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Assignee
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416 MAETAN-DONG, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 8910
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RESTON, VA 20195
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