Patent Assignment Details
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Reel/Frame: | 024260/0033 | |
| Pages: | 8 |
| | Recorded: | 04/20/2010 | | |
Attorney Dkt #: | YOR920080504US3 (14-19-2) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/10/2012
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Application #:
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12763596
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Filing Dt:
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04/20/2010
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Publication #:
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Pub Dt:
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08/12/2010
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Title:
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LOCK AND KEY THROUGH-VIA METHOD FOR WAFER LEVEL 3D INTEGRATION AND STRUCTURES PRODUCED
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Assignee
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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Correspondence name and address
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THE LAW OFFICES OF ROBERT J. EICHELBURG
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HODAFEL BUILDING, SUITE 200
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196 ACTON ROAD
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ANNAPOLIS, MD 21403
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