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Reel/Frame:040329/0033   Pages: 5
Recorded: 11/15/2016
Attorney Dkt #:APT1997-0826D01_D02
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
11/20/2001
Application #:
09556244
Filing Dt:
04/24/2000
Title:
SEMICONDUCTOR WAFER ASSEMBLIES
2
Patent #:
Issue Dt:
02/05/2002
Application #:
09645057
Filing Dt:
08/23/2000
Title:
Etching methods
Assignor
1
Exec Dt:
03/13/1998
Assignee
1
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83706
Correspondence name and address
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD
MAILDROP A700
PHOENIX, AZ 85008

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